Whether for artificial intelligence, augmented reality or the Internet of Things, five billion people worldwide will be using smart devices to sense their environment next year. Infineon Technologies has developed a 60GHz radar chip, which enables a new form of interaction between users and their devices. 

Infineon Technologies has introduced the new OptiMOS IR3826(A)M integrated point-of-load DC/DC voltage regulator. It is a fully integrated and highly efficient device in two versions (IR3826AM for 16A and IR3826M for 23A) for applications such as netcom router and switches, datacom, telecom base stations, server and enterprise storage.

For fast and cost-effective implementation of NFC programming for LED drivers, Infineon Technologies developed the NFC-PWM series NLM0011 and NLM0010. NFC programming is an emerging technology designed to replace the labour-intensive ‘plug-in resistor’ current setting method via contactless NFC interface.

Automotive lighting as an important safety and popular design feature in vehicles has evolved rapidly in the past years. Now, Nichia Corporation and Infineon Technologies start a collaboration to add further momentum to this evolution. Together, they are developing a high-definition (HD) light engine with more than 16,000 micro-LEDs for front light applications.

By 2030, it is predicted that 50% of newly registered vehicles will be electrically powered, connected or automated. This dramatic upsurge in functionality requires a new system approach in vehicle architecture to support electromobility and highly automated driving.

Demand for energy efficient charging solutions is rising fast. In order to address the fast growing demand for Silicon Carbide (SiC) solutions in this field, Infineon Technologies launched two new EasyPACK modules of the 1,200V family. Both, Easy 1B and Easy 2B, integrate CoolSiC MOSFETs aiming not only at this market but also at UPS applications.

Hardware-based trust anchors are key for connected applications and smart services, whether for a robotic arm in the smart factory or automated air conditioning in a private home. The new OPTIGA Trust M solution from Infineon Technologies helps manufacturers to enhance the security of their devices while at the same time improving overall system performance. 

Infineon Technologies has released a new LED driver IC to its XDP portfolio. The XDPL8210 is a constant current flyback IC with a high power factor and primary-side regulation. Key advantages of designing with XDPL8210 include outstanding functional performance for efficient designs as well as low bill-of-material (BOM) for small system cost and high flexibility. 

Compared with traditional three-level neutral-point-clamped topologies, the advanced neutral-point-clamped (ANPC) inverter design supports an even loss distribution between semiconductor devices. Infineon Technologies utilises the ANPC topology for its hybrid SiC and IGBT power module EasyPACK 2B in the 1,200V family. 

For the Sensor+Test trade fair, Infineon Technologies is expanding its sensor portfolio by a new family of AMR-based angle sensors. XENSIV TLE5109A16 products address the need for very precise, fast and yet cost-efficient angle measurement at the highest functional safety levels in automotive and industrial applications.

City dwellers often spend a large amount of their time indoors, either in an office, at school, or simply at home. Urbanised spaces, however, tend to trap and develop bad air quality as they get more insulated for energy efficiency purposes. The concentration of CO2 is an indicator for bad air quality. 

Infineon Technologies will launch a monolithically integrated linear Hall sensor which was developed entirely according to the safety standard ISO26262 for automotive applications. The XENSIV TLE4999I3 enables the development of fault-tolerant systems that have to meet the highest level of functional safety (ASIL D).

At the Sensor+Test trade fair, Infineon Technologies is presenting the new XENSIV absolute pressure sensor series KP276. It addresses applications such as the measurement of manifold air pressure (MAP) in aspirated or turbo (Turbo MAP) diesel and gasoline engines as well as exhaust gas recirculation.

  Infineon Technologies is presenting its latest sensors and solutions for intelligent mobility, the smart home, connected industry, robotics, and health and fitness at this year’s Sensor+Test. The exhibits and solutions are on view during the trade fair (25th to 27th June) at stand 429 in hall 1.

The city of Vinnitsa, Ukraine, is implementing a new system for automated fare collection based on the CIPURSE open security standard. Infineon Technologies has been selected as sole supplier of the security chips to be embedded into 200,000 transportation cards for the city’s trams and busses. The cards will be issued from summer 2019 onwards.

The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight countries will research and develop innovative power semiconductors with more power density and energy efficiency. Power semiconductors are needed in all stages of energy conversion: generation, transmission, and use. 

It has been announced that Infineon Technologies and Cypress Semiconductor have signed a definitive agreement under which Infineon will acquire Cypress for $23.85 per share in cash, corresponding to an enterprise value of €9bn. With the addition of Cypress, Infineon will consequently strengthen its focus on structural growth drivers and serve a broader range of applications.

Infineon Technologies has launched the XENSIV DPS368. The miniaturised digital barometric pressure sensor is capable of measuring both pressure and temperature. It offers an ultra high precision of ±2cm and a low current consumption for precise measurement of altitude, air flow and body movements. This makes the DPS368 suitable for mobile applications and wearable devices offering e.g. activity tracking and navigation.

Smartphone cameras increasingly require 3D vision capabilities as differentiating factor. Hence, Infineon Technologies developed the REAL3 IRS2381C, a premier 3D imager sensor solution especially designed for the mobile device market. The Embedded Vision Alliance now awarded the 3D Time-of-Flight (ToF) single chip solution as 'Product of the Year' in the category 'Sensors'.

Infineon Technologies enters high volume production of a comprehensive portfolio of 1,200V CoolSiC MOSFET devices. They are rated from 30-350mΩ and implemented into TO247-3 and TO247-4 housings. The expansion includes a surface mount device (SMD) portfolio and a 650V CoolSiC MOSFET product family, both to be launched soon.