Infineon Technologies AG today raised the guidance for the first quarter of the 2009/10 fiscal year. For the first quarter of the 2009/10 fiscal year Infineon now expects high single digit growth in group revenues compared to the fourth quarter of the 2008/09 fiscal year and high single digit margin for the Combined Segment Result. This increase is mainly driven by the Automotive (ATV) and Industrial & Multimarket (IMM) segments.

A research project to strengthen German competiveness by developing processes and verification methods for more flexible and secure automated manufacturing has been launched by leading German companies. The SANITAS (”Enabling safer systems by a new collaborative verification methodology across the entire value chain”) project includes nine partners – research institutes and companies from the semiconductor, automotive and industrial automat...

Infineon Technologies AG and Nokia today announced a cooperation to develop advanced radio frequency transceiver solutions. The agreement covers a non-exclusive collaboration to ensure the compatibility and interworking of Nokia’s advanced licensable baseband modem technologies and Infineon’s leading RF solutions.

Infineon Technologies is extending its portfolio of energy efficient lighting ICs with a new family of low cost linear LED drivers. The new BCR320 and BCR420 product families address the burgeoning market for energy-saving and environmentally friendly light-emitting diode (LED) lighting solutions. Specifically designed for driving 0.5W LEDs with a typical current of 150mA to 200mA, these LED drivers feature a negative thermal coefficient contrib...

Infineon Technologies today announced it is the world’s first semiconductor provider of TPM (Trusted Platform Module) security chips that successfully passed most stringent security tests currently defined for PC security. The Trusted Computing Group (TCG), an impartial not-for-profit organization, confirmed that Infineon’s TPM is “TCG Certified”. The TCG certification is based on the international security standard “Common Criteria”...

The growing complexity of microelectronic systems makes it necessary to align and coordinate the development of chips, packages and boards at a very early stage, especially when it comes to system-in-package (SiP) applications.