Infineon Technologies is expecting significant growth in hybrid vehicles 48V systems in the coming years and is expanding its portfolio of suitable power devices. The chip manufacturer is launching new packages for its 80V and 100V MOSFETs with OptiMOS 5 technology to meet the different requirements of different 48V applications.

Infineon Technologies has extended its embedded SIM (eSIM) portfolio with the new OPTIGA Connect eSIM solution for mobile consumer devices. This solution fully supports all GSMA standards from 3G to 5G and securely authenticates the device to the subscribed carrier network of choice. 

GMO GlobalSign and Infineon Technologies have announced a solution that secures, simplifies, and streamlines device enrolment into Microsoft Azure IoT Hub and IoT Hub Device Provisioning Service. The collaboration eases complex device identity integration challenges and delivers a proven path for IoT device security literally from chip to cloud.

Electro-mobility, advanced driver assistance systems, connected driving – the demand for functionally safe electrical and electronic systems in cars is increasing. Infineon Technologies’ second generation AURIX (TC3xx) microcontrollers are the embedded safety controllers certified for the highest automotive safety integrity level (ASIL D) according to the latest version of the ISO 26262 standard. 

Infineon Technologies is releasing the new IMC300 motor controller series. It combines the iMOTION Motion Control Engine (MCE) with an additional microcontroller based on the Arm Cortex-M0 core. IMC300 complements the IMC100 series and aims at variable speed drives that require very high application flexibility. 

Infineon Technologies has continued to expand its comprehensive silicon carbide (SiC) product portfolio with MOSFET 650V devices. With the newly launched CoolSiC MOSFETs Infineon is addressing the growing demand for energy efficiency, power density, and robustness in a wide range of applications. Amongst them are server, telecom and industrial SMPS, solar energy systems, energy storage and battery formation, UPS, motor drives as well as EV-chargi...

Building on superjunction technology innovations and more than 20 years of experience, Infineon Technologies has broadened its CoolMOS portfolio with the PFD7 product family combining performance with ease of use. The devices are suitable for ultrahigh power-density designs such as chargers and adapters as well as for low-power drives and specific lighting applications.

Infineon Technologies has announced that it is focusing on system innovation with enhancements on component level by addressing the challenges of modern power management designs. The Source Down is the new industry standard packaging concept. The first wave of power MOSFETs launched in this new package is the OptiMOS 25V in a PQFN 3.3x3.3mm.

Infineon Technologies is taking the next step towards smallest power supply devices for automotive electronics. As first chipmaker, the company set up a dedicated production process for flip-chip packages that is fully aligned with the high-quality requirements of the automotive market. Infineon has launched the first respective product: the linear voltage regulator OPTIREG TLS715B0NAV50.

The installed photovoltaic capacity is growing rapidly worldwide. Photovoltaic systems with a total output of around 600GW now supply clean and cost-effective electricity – replacing around 600 medium-sized coal-fired power plants. SMA Solar Technology (SMA) and Infineon Technologies have supported this growth trend with the latest generation of innovative silicon carbide (SiC)-based solar inverters. 

At this year’s embedded world, Infineon Technologies has announced that it will present easy-to-integrate technology for smart mobility, smart industry and smart lifestyle. Focussing on holistic system solutions, the Infineon booth will feature applications for automated driving and in-vehicle health monitoring, wireless charging, multicopters and drones as well as automotive and industrial gateways.

Infineon Technologies’ new 40nm generation of security chip solutions – the SLC3x – is based on a design concept that provides performance and scalability for a vast array of smart card applications. Smart card manufacturers and payment solution providers will benefit from a family architecture based on the de-facto industry standard ARM, as well as innovative logistic concepts.

Infineon Technologies has broadened its EiceDRIVER portfolio with the 650V half-bridge gate drivers based on Infineon’s silicon on insulator (SOI) technology. The products provide leading negative transient voltage immunity, monolithic integration of a real bootstrap diode, and superior latch-up immunity for MOSFET and IGBT based inverter applications.

Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data. Infineon Technologies has collaborated with software and 3D Time of Flight system specialist, pmdtechnologies to develop the world’s smallest and at the same time most powerful 3D image sensor, and is presenting it at CES in Las Vegas.

Infineon Technologies AG introduced the new IGBT7 chip for its well-known Easy housing platform in March. Now it is taking the TRENCHSTOP IGBT7 to the arena of medium power: in the standard industry package EconoDUAL 3. In this chip technology, the 1200V module provides a leading nominal current of 900A enabling a 30% higher inverter output current for the same frame size compared with the former technology. 

Connected machines and ICT systems require security mechanisms that are particularly robust and remain so for the long life common with industrial hardware. Withstanding attacks over the long term means keeping the protections at the through updates. Researching and assessing such updatable security mechanisms was the objective of the joint ALESSIO project. 

Smart factories and connected supply chains are presenting manufacturing companies with new opportunities. Sophisticated automation and self-optimisation through machine learning and artificial intelligence (AI) are promising highly optimised processes and increased production efficiency – hence more productivity with the same input. Anasthasia Westphal, Product Marketing Manager, Digital Security Solutions, Infineon Technologies explains m...

Silicon carbide (SiC) is en route to mainstream for applications like photovoltaic and uninterruptable power supplies. Infineon Technologies is now targeting the next group of applications for this wide bandgap technology: the evaluation board EVAL-M5-E1B1245N-SiC aims to help to pave the way for SiC in motor drives and help strengthening Infineon’s market position as #1 for industrial SiC. 

Infineon Technologies broadens its CoolGaN series with two devices. The CoolGaN 400V device (IGT40R070D1 E8220) is tailored for premium HiFi audio systems where end users demand every detail of their high resolution sound tracks. These have been conventionally addressed by bulky linear or tube amplifiers.

Infineon Technologies will add a new member to its automotive microcontroller family AURIX. TC3A will address new automotive 77GHz radar applications such as high-end corner radar systems for advanced driver assistance systems and automated driving. New features include a new signal processing unit, a large SRAM memory dedicated to radar and four TriCore processors running at 300MHz with two additional lockstep cores.