Infineon Technologies has introduced the XENSIV 4th generation TLE4960x magnetic switch family.

Infineon Technologies and Marelli, an automotive systems manufacturer, are partnering to advance automotive display technology with an innovative MEMS laser beam scanning (LBS) system.

At PCIM Europe 2025 in Nuremberg, Infineon will showcase its latest semiconductor, software and tooling solutions that help to solve today’s green and digital transformation challenges.

The market for electric vehicles (EV) continues to gather pace with a strong volume growth of both battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). The share of electric vehicles produced is expected to see double-digit growth by 2030 with a share of around 45% compared to 20% in 2024 [1].

Watch our exciting webinar and discover the power conversion topologies for bidirectional EV charging. Don'tmiss out on this electrifying opportunity! Register now to join us for the webinar and discover the potential of bidirectional charging.  Today's global challenges of decarbonization, combined with rising energy demand, make bidirectional electric vehicle charging and how semiconductor solutions support this application more impor...

The rise of renewable energy and electric vehicles is placing unprecedented demands on the electricity grid. A smart charging infrastructure (SCI) is essential to maintain grid stability, improve efficiency, and create new commercial opportunities. In this whitepaper, Infineon explores: What makes a charging infrastructure truly smart and more.

As vehicle architectures transition to hybrid and electric models, conventional battery systems are increasingly being supplemented or replaced by 48V power sources. This shift is expected to become the new standard for future electric vehicles, as 12V and 24V power net systems reach their limits.

Infineon Technologies, working with its partner RT-Labs, has integrated six Fieldbus and Ethernet-based protocols in the firmware of the Infineon XMC7000 industrial microcontroller. 

Infineon has allowed Enphase Energy to simplify its system design and reduce assembly costs.

Infineon has announced the introduction the E-version of its hybrid flyback controller family following popular demand.

Infineon has announced the CoolSiC Schottky diode 2000V G5 product family has now been expanded to include a Schottky diode in the TO-247-2 package, which is pin-compatible with most existing TO-247-2 packages.

Infineon Technologies expands its XDP digital protection product family with the XDP711-001, a 48V wide input voltage range digital hot swap controller with a programmable safe operating area (SOA) control designed for high-power AI servers.

To further support developers, Infineon has introduced new affordable development kits and free integrated development environments (IDEs), supported by comprehensive software tools, tutorials, and an extensive ecosystem.

Infineon Technologies has launched its roadmap for Battery Backup Unit (BBU) solutions for uninterrupted operations of AI data centres to avoid power outages and risk of data loss

HighTec EDV-Systeme has released its new LLVM-based, automotive-grade RISC-V compiler designed to support the Infineon automotive RISC-V virtual prototype.

Microcontrollers (MCU) are at the heart of modern electronics, and integrating the latest AI development and deployment workflows at the Edge poses a major challenge for developers.

Infineon Technologies has launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute. Through enhanced system performance and with Infineon’s trademark robustness, the new TDM2454xx quad-phase power modules enable best-in-class power density and total-cost-of-ownership (TCO) for AI data centres operators.

Infineon is launching Drive Core, a scalable software bundle portfolio for AURIX, TRAVEO, and PSOC that facilitates a rapid start into automotive software development. Drive Core bundles pre-integrated software and tools from Infineon and third-party providers ready-to-use under a three-month evaluation license.

Infineon has announced the addition of P-channel power MOSFETs to its family of radiation-tolerant power MOSFETs for Low-Earth-Orbit (LEO) space applications.

Infineon Technologies announced achieving a milestone in its automotive cybersecurity.