Infineon has allowed Enphase Energy to simplify its system design and reduce assembly costs.

Infineon has announced the introduction the E-version of its hybrid flyback controller family following popular demand.

Infineon has announced the CoolSiC Schottky diode 2000V G5 product family has now been expanded to include a Schottky diode in the TO-247-2 package, which is pin-compatible with most existing TO-247-2 packages.

Infineon Technologies expands its XDP digital protection product family with the XDP711-001, a 48V wide input voltage range digital hot swap controller with a programmable safe operating area (SOA) control designed for high-power AI servers.

To further support developers, Infineon has introduced new affordable development kits and free integrated development environments (IDEs), supported by comprehensive software tools, tutorials, and an extensive ecosystem.

Infineon Technologies has launched its roadmap for Battery Backup Unit (BBU) solutions for uninterrupted operations of AI data centres to avoid power outages and risk of data loss

HighTec EDV-Systeme has released its new LLVM-based, automotive-grade RISC-V compiler designed to support the Infineon automotive RISC-V virtual prototype.

Microcontrollers (MCU) are at the heart of modern electronics, and integrating the latest AI development and deployment workflows at the Edge poses a major challenge for developers.

Infineon Technologies has launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute. Through enhanced system performance and with Infineon’s trademark robustness, the new TDM2454xx quad-phase power modules enable best-in-class power density and total-cost-of-ownership (TCO) for AI data centres operators.

Infineon is launching Drive Core, a scalable software bundle portfolio for AURIX, TRAVEO, and PSOC that facilitates a rapid start into automotive software development. Drive Core bundles pre-integrated software and tools from Infineon and third-party providers ready-to-use under a three-month evaluation license.

Infineon has announced the addition of P-channel power MOSFETs to its family of radiation-tolerant power MOSFETs for Low-Earth-Orbit (LEO) space applications.

Infineon Technologies announced achieving a milestone in its automotive cybersecurity.

At embedded world in Nuremberg Infineon Technologies will showcase how its semiconductor solutions meet the needs for powerful, efficient, and secured microcontrollers for reliable operation.

Infineon provides sensor technology to Roborock for its state-of-the-art Saros Z70 robotic vacuum. The standout feature of the smart robot is its industry-first five-axis robot arm that can move obstacles out of its way and clean in areas that were previously blocked.

Infineon is releasing support for computer vision in DEEPCRAFT Studio, expanding on the existing support for audio, radar and other time-series data.

Infineon Technologies announced the availability of its Apple Find My network accessory support for the AIROC™ CYW20829, PSOC 63 Bluetooth microcontroller (MCU), AIROC CYW5591x Wi-Fi/BT connected MCU and AIROC CYW5551x within its ModusToolbox.

Infineon Technologies and Eatron extend their existing partnership for battery management solutions (BMS) in automotive to a comprehensive BMS portfolio including various industrial and consumer applications.

SECORA Pay Green by Infineon Technologies is paving the way for more sustainable payment cards, and has motivated Mastercard to admit Infineon into its Greener Payments Partnership (GPP) advisory council.

Manufacturers of cutting-edge audio equipment constantly seek to enhance sound quality while also meeting the growing demand for compact, lightweight, more integrated, and energy-efficient designs. At the same time, they must ensure seamless connectivity, cost-effectiveness, and user-friendly functionality, making audio product development more complex than ever.

Gallium Nitride (GaN) technology plays a crucial role in enabling power electronics to reach the highest levels of performance. However, GaN suppliers have thus far taken different approaches to package types and sizes, leading to fragmentation and lack of multiple footprint-compatible sources for customers.