Infineon and Quantinuum have announced a strategic partnership to develop the future generation of ion traps.

The safe hot-swap operation in AI servers and telecom requires MOSFETs with a robust linear operating mode as well as a low R DS(on). Infineon Technologies addresses this challenge with the new OptiMOS 5 Linear FET 2, a MOSFET designed to provide the ideal trade-off between the R DS(on) of a trench MOSFET and the wide safe operating area (SOA) of a classic planar MOSFET.

The safe hot-swap operation in AI servers and telecom requires MOSFETs with a robust linear operating mode as well as a low R DS(on)

Stellantis and Infineon have announced they will work jointly on the power architecture for Stellantis’ electric vehicles to support Stellantis’ ambition of offering clean, safe and affordable mobility to all.

Infineon recently announced the laucnh of a new family of high-voltage discretes, the CoolGAN Transisotrs 650V G5, strengthening its Gallium Nitride (GaN) portfolio.

Infineon is launching the new MOTIX TLE9189 gate driver IC for safety-critical applications for 12V brushless DC (BLDC) motors.

Infineon develops innovative products to help pave the way to a sustainable AI era, offering improved, smaller, and more cost-effective systems and solutions for more eco-friendly AI applications. EBV & Infineon are teaming up at electronica, where visitors will have the opportunity to explore five joint pop-up boothsand enter a prize draw, including the chance to win a Samsung Galaxy Watch 7.Discover how Infineon’s innovative products ...

Infineon has introduced DEEPCRAFT, a new software solution category brand for Edge AI and Machine Learning.

After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon Technologies has unveiled the next milestone in semiconductor manufacturing technology.

At the upcoming electronica trade show in Munich, Infineon will illustrate how its solutions are driving the global trends of decarbonisation and digitalisation.

Infineon has introduced the CoolSiC Schottky diode 2000V G5, the first discrete silicon carbide diode on the market with a breakdown voltage of 2000V.

Watch our exciting webinar and discover the power conversion topologies for bidirectional EV charging. Don'tmiss out on this electrifying opportunity! Register now to join us for the webinar and discover the potential of bidirectional charging.  Today's global challenges of decarbonization, combined with rising energy demand, make bidirectional electric vehicle charging and how semiconductor solutions support this application more impor...

Infineon Technologies’ IGC033S10S1 has been shortlisted for the Electronics Excellence Awards under the Power Product category.

Infineon Technologies is paving the way to a significant reduction of plastic waste and CO2 emissions in the payment card industry. The company has announced the launch of SECORA Pay Green which enables card designs allowing production of the world’s first fully recyclable contactless (dual-interface) payment card bodies based on environmentally friendly and locally sourced materials.

Infineon is introducing the HybridPACK Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector.

Infineon has introduced the Automotive PSoC Multitouch GEN8XL (IAAT818X), a new generation of touch controllers.

Infineon hosted its first-ever Supplier Sustainability Summit to further stimulate collaboration and incentivise and support suppliers to accelerate their decarbonisation journeys. The virtual event brought together about 100 top semiconductor industry suppliers.

Data centres currently account for over 2% of global energy consumption. With the rise of AI, this figure is predicted to increase to as much as 7% by 2030, which would be equivalent to the current energy consumption of India. 

Infineon Technologies announced a partnership with Canada-based AWL-Electricity Inc., a pioneer in MHz resonant capacitive coupling power transfer technology.

In battery-powered applications such as motor drives and switched-mode power supplies (SMPS), the power supply architecture often requires that a module can be disconnected from the main supply rail when a fault occurs in that module.