Infineon Technologies is a new partner in the Volkswagen Group’s strategic supplier network FAST (Future Automotive Supply Tracks). This programme stands for close cooperation in key future fields. Infineon contributes significantly to the move toward electric drivetrains by the world’s largest car maker. Infineon’s power modules control the electric drive in Volkswagen’s modular electric drive matrix MEB, which is the ind...

In order to support the automotive industry by building up a broad and cost competitive portfolio of hybrid and electric vehicles (xEV), Infineon Technologies is launching new power modules for xEV main inverters. At this year’s PCIM trade fair Infineon will present four new HybridPACK Drive modules optimised for different inverter performance levels between 100 and 200kW.

It has been announced that Infineon Technologies is extending the CoolSiC Schottky 1,200V G5 diode portfolio with the release of a TO247-2 package. It can easily replace silicon diodes for higher efficiency. The expanded 8.7mm creepage and clearance distances offer extra safety in high-pollution environments. 

A new technology has been developed by Infineon Technologies and Schweizer Electronic, for the mild-hybridisation of cars; chip embedding for Power MOSFETs. It is set to significantly improve the performance of 48V systems while reducing their complexity. Continental Powertrain will be the first player to adopt the technology.

At this year’s PCIM trade fair, Infineon Technologies will launch a new family of current sensors and is presenting its first member. The family will consist of precise and stable coreless Hall sensors. They offer a high level of flexibility as customers can individually program product parameters such as the current range, the overcurrent threshold and the output mode.

A new member has been added to the growing family of intelligent power modules (IPMs): CIPOS Tiny from Infineon Technologies. The three-phase inverter module is the newest generation of IPM to offer the highest power density for variable speed motor drives. By using the latest TRENCHSTOP IGBT6, it is possible to realise maximum efficiency with minimum footprint.

A zero-voltage-switching (ZSC) switched capacitor converter has been introduced by Infineon Technologies. It features a two-stage architecture for 48V applications to power up CPUs, GPUs, SoCs, ASICs, and memory. Infineon’s full system concept for 48V architecture paves a way towards 99% of efficiency.

According to the latest research from Strategy Analytics, Infineon Technologies increased its automotive business in Japan by almost 25% in 2018. It thus grew faster than any other of the top ten automotive semiconductor suppliers in the country. Japan accounts for approximately ten percent of global car production. 

It has been announced that Infineon Technologies has extended its Easy family to include a new package: Easy 3B. Together with the other Easy 1B and 2B packages, this comprises the broadest power module portfolio at 12mm height without base plate. Easy 3B is a well suited platform to extend current inverter designs to achieve higher power without changing much on the mechanical side.

It has been announced that Infineon is hoping to strengthen its research and development efforts in the field of high-frequency components. To this end the Infineon Austria holding company DICE (Danube Integrated Circuit Engineering) in Linz will be provided with a new home.

A new member to the XDP LED controller series has been introduced by Infineon Technologies, with the digital and highly integrated XDPL8218 for cost effective LED drivers. The device features a future proof design and combines a constant voltage quasi-resonant flyback controller with algorithms for high power factor (more than 0.9) and low total harmonic distortion (THD less than 15%).

Infineon Technologies extents its large portfolio of high voltage devices with a new package: XHP 3. This is a new flexible IGBT module platform for high power applications in the voltage range from 3,3kV up to 6,5kV. The module allows for scalable designs with reliability and highest power density. Due to its symmetrical design with low stray inductance it offers significantly improved switching behaviour.

Infineon Technologies is introducing its CIPOS Micro IM231 series, a family of 600V rated Intelligent Power Modules (IPM). It is qualified for harsh humid environments, passing 1,000 hours of high voltage, high temperature and high humidity reverse bias (HV H3TRB) stress testing. For this reason, the energy-efficient IPM suits power appliance motor drives particularly in circulator hydronic pumps, drain pumps for washing machines, dishwashers, an...

Two new members of the BCR linear LED controller IC portfolio from Infineon Technologies have been introduced with the BCR601 and BCR602. The BCR601 features an innovative voltage feedback to the primary side also known as ‘active headroom control’ (AHC), enabling cost and power effective LED driver applications.

Extending its portfolio of high current system chipset solutions, Infineon Technologies has introduced a 16-phase digital PWM multiphase controller, the XDPE132G5C. The portfolio enables currents of 500 to 1,000A and higher for next generation CPUs, GPUs, FPGA and ASICs used in high-end artificial intelligence (AI) servers and 5G datacom applications.

Power density is key in latest space constrained storage, netcom, servers and telecom designs. Infineon Technologies has introduced the newest member of its integrated point-of-load product family, the IR38164 DC-DC POL converter. Infineon's IR38x6x family offers either full SVID compatibility or 3-bit PVID flexibility. This makes it easy to design and support Intel CPU and chipset POL rails in Intel systems.

The emerging trend of smart lighting and Internet of Things, requires a new generation of LED drivers. Infineon Technologies has introduced a new member of its XDP LED series, the XDPL8221 for cost-effective dual-stage drivers with advanced features. This device combines a quasi-resonant PFC and a quasi-resonant flyback controller with primary side regulation together with a communication interface.

The emerging trend of smart lighting and the Internet of Things, requires a new generation of LED drivers. Infineon Technologies has introduced the new member of its XDP LED series, the XDPL8221 for cost-effective dual-stage drivers with advanced features. This device combines a quasi-resonant PFC and a quasi-resonant flyback controller with primary side regulation together with a communication interface. 

Smart IPM motor controllers featuring full hardware and software integration needed for BLDC motor drives of up to 80W without heatsink have been introduced by Infineon Technologies. The new iMOTION IMM100 series combines the motor controller IC and a three-phase inverter stage in a single, highly compact 12x12mm2 PQFN package.

In order to provide more flexibility in how to use safety microcontrollers in automotive and industrial applications, Infineon has cooperated with Xilinx and Xylon. At Embedded World, they will present a new Xylon IP core called logiHSSL. It enables communication between Infineon’s AURIX TC2xx and TC3xx microcontrollers and Xilinx’ SoC, MPSoC and FPGA devices via the Infineon High Speed Serial Link. ...