Search results for "chiplet"

The SiP market was worth $21.2 billion in 2022 and is projected to reach $33.8 billion by 2028, growing at an 8.1% CAGR.

Cadence Design Systems has announced the availability of new system prototyping flows based on the Cadence Integrity 3D-IC Platform that support the 3Dblox 2.0 standard.

Synopsys has announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC’s 3DFabric technologies.

Pushing ahead with the European Union (EU) funded photonixFAB initiative, the consortium partners have taken the first step on the path to industrialise the European silicon photonics value chain by providing early access to R&D and small-scale manufacturing through technology partners.

Intel has announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.

Siemens Digital Industries Software has recently announced its introduction of a novel method for distributing precise thermal models of integrated circuit (IC) packages throughout the electronics supply chain.

Jim Keller, a name synonymous with groundbreaking developments in the computing world, just last September embarked on his latest technological endeavour as the CEO of Tenstorrent.

Flash Memory Summit have announced this year's recipient of its Lifetime Achievement Award: Amber Huffman of Google Cloud.

Arteris, Inc. and Semidynamics announced a partnership to accelerate electronic product innovation for artificial intelligence, machine learning, and high-performance computing (HPC) applications.

Keysight Technologies introduces the first PCI Express (PCIe) 6.0 protocol validation tools.