Search results for "Congatec"

congatec has presented a new COM-HPC starter set at embedded world 2021 DIGITAL. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (cod...

congatec has presented its new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.

congatec has introduced the conga-TCV2, a COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module has good performance per watt, and finds its sweetest spot in 15W TDP designs.

congatec has focused on customers’ ruggedisation challenges for virtual embedded world 2021, and will be presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules.

Tasks at the embedded edge are getting more and more complex. Supporting up to eightcores and 16threads, the recently launched AMD Ryzen Embedded V2000 processors are hoping to pave the way for x86-based embedded designs with high compute density and performance per watt.

Gordon E. Moore, one of the Co-founders of chipmaker Intel, predicted famously that the computing capacity of a microchip would double every two years, in what is now known as Moore’s Law. Despite having faster computers and phones, train passengers have in the past not been able to benefit from a stable internet access on their journey. Here, Martin Frederiksen, Managing Director ofRecab UK, explores the technological changes that will all...

congatec has introduced the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilisation of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name Tiger Lake).

In the space of 12 months, industry has changed completely. The way that manufacturers operate has fundamentally changed, bringing in a renewed need for embedded systems that support remote operations and contactless authentication and validation of the workforce. Here, Martin Frederiksen, Managing Director ofRecab UK, explores how 2020 brought new technologies to manufacturing plants.

congatec has broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint.

congatec has introduced new application-ready platforms for tactile internet applications over public broadband as well as private IP networks. They support Time Sensitive Networking (TSN) in combination with the new Intel Time Coordinated Computing (Intel TCC) technology, which complements the TSN Ethernet standard based on latest Intel IP technology.