Search results for "Congatec"

PICMG, a consortium for developing open embedded computing specifications, announces that the COM-HPC Carrier Board Design Guide is released and freely available on the PICMG website.

congatec has introduced new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40 to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

congatec has announced the foundation of congatec Korea to meet increasing customer demand in South Korea. The establishment of a new subsidiary underlines the importance of Korea for congatec’s global business success.

congatec has extended its i.MX 8 ecosystem with a new starter set for AI accelerated intelligent embedded vision applications. Based on a SMARC Computer-on-Module with i.MX 8M Plus processor, the starter set’s sweet spot is the utilisation of the new processor integrated NXP Neural Processing Unit (NPU).

Recab UK is set to support embedded computing projects in the rail, automotive, aerospace, and marine transport markets with a new ultra-rugged computer on module (COM) from congatec. The recently released conga-TC570r is a COM Express Type 6 module based on an 11th Generation IntelCoreprocessor, with an extended temperature range and soldered memory to ensure consistent performance in transport environments prone to high shock and vibration.

For millennia, humans have endeavoured to artificially control growing environments to boost crop and plant growth. Today, the most common form of controlled environment agriculture (CEA) is the greenhouse. However, efficiency and waste remain two of the largest challenges for greenhouses, leading to the development of robots to improve operations. However, this is not without its own challenges — challenges that require the latest computin...

The congatec CMEF showcase put the spotlight on the latest embedded computing and artificial intelligence (AI) technologies for medical imaging and diagnostics, operating theaters as well as mobile emergency and intensive care equipment.

PICMG announces the release of the COM-HPC Platform Management Interface (PMI) specification.It provides a framework of remote and out-of-band platform management features for COM-HPC Computer-on-Module based edge computing designs and is freely available on the PICMG website. COM-HPC is an open Computer-On-Module (COM) form factor standard for High-Performance Computing (HPC) that combines high-end I/O bandwidth with edge computing performance l...

congatec has presented a low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.

congatec has introduced a brand new COM-HPC starter set. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (code name Tiger Lake).