Search results for "Congatec"

AMI and congatec announce the celebration of their 20-year business partnership. Since 2005, AMI and congatec have worked closely together to deliver innovative embedded computing solutions to customers worldwide. This long-standing collaboration has driven both companies to develop advanced technologies and provide exceptional support to their shared customer base – even for the most sophisticated technical challenges for embedded systems...

congatec's Computer-on-Module conga-TC750 has been shortlisted for the Electronics Excellence Awards under the Electromechnical Product category.

congatec has expanded its portfolio of high-performance COM-HPC Computer-on-Modules (COMs) with the conga-HPC/cBLS, which has been developed for power-hungry Edge and infrastructure applications.

congatec has announced a partnership with Canonical, the publisher of Ubuntu, enabling congatec to offer the best out-of-the-box experience by bulding aReady.COMs wityh Ubuntu Pro.

At embedded world North America,congatec unveiledits latest hardware and software offerings designed to streamline product development and improve time-to-market for its customers.

congatec boosts AI performance for medical, robotics, industrial, retail, and gaming applications, delivering up to 99 TOPS.

congatec premiered its heat pipe cooling solution for extreme environmental conditions at embedded world 2025. The cooling solution uses acetone as a working fluid in the heat pipes instead of water. This prevents the thermal transfer medium from freezing at extreme sub-zero temperatures and prevents damage to the cooling solution, the module, and the entire system design. It is also insensitive to mechanical stresses such as shock and vibration.

congatec, a provider of embedded and Edge Computing technology, is updating its conga-SA8 SMARC modules: the low-power Computer-on-Modules (COMs) are now available with the latest Intel Core 3 processor generation.

congatec, a provider of embedded and Edge computing technology, presents new high-performance computer-on-modules (COMs) with i.MX95 processors from NXP, thereby expanding its extensive module portfolio with low-power NXP i.MX Arm processors.

For the first time, Intel Core i processors with up to eight E-cores are now available on SMARC Computer-on-Modules. This allows even the smallest fanless low-power systems for extended temperature ranges to benefit from extremely powerful AI inference logic and enhanced virtualisation options, improving cyber security among other advantages.