Search results for "Congatec"

congatec has significantly broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched on the COM Express Compact footprint.

congatec has announced the launch of 12 brand new Computer-on-Modules in parallel with the Intel IOTG (Internet of Things Group) launch of the 11th Gen Intel Core processors. Based on the new low-power high-density Tiger Lake SoCs the new modules offer greater CPU performance and higher GPU performance along with PCIe Gen4 and USB4 support.

Digi-Key plans to roll out its Digi-Key Marketplace in the EMEA region early next year.

The Deutsche Beteiligungs AG (DBAG) is investing in congatec. Today, with more than two-thirds of congatec's revenue coming from customers based in Europe, congatec expects to see its share of sales with customers in the USA and Asia growing rapidly, and also expects this trend to accelerate.

In parallel with the 11th Gen Intel Core processor launch (code named “Tiger Lake”), congatec has announced the availability of both its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module. This provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilising COM-HPC’s broader array of interfaces.

Following the release of Intel’s new 11th Gen IntelCoreand Intel Atomx6000E Series processors,Recab UKis offering new Computer-On-Modules (COMs) fromcongatecto the UK market. Recab UK will provide baseboard and system designs based on the new congatec modules in a range of form factors, including the new COM high performance computing (COM-HPC) standard.

congatec has extended its conga-TR4 series of COM Express modules with processors from the new AMD Ryzen Embedded R1000 series. Based on the acclaimed Zen microarchitecture, this new generation of energy-efficient processors delivers the best low-power computing performance in its class and is optimised for price sensitive markets.

congatec has presented its brand new workload consolidation kit for vision based situational awareness that is qualified by Intel as Intel IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel Xeon E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems' hypervisor technology for workload consolidation in vision applications.

As the embedded electronics world eagerly awaits the release of the new Computer on Module (COM) standard, COM for High Performance Computing (COM HPC), Martin Frederiksen, Managing Director ofembedded computer systems provider,Recab UK, reflects on how its predecessor, the COM Express Type 7, will continue to impact on baseboard designs in telecoms for many years to come.

congatec has announced its brand new conga-SMC1/SMARC-x86 3.5" carrier board. The new size-optimised SMARC 2.1 carrier board in 3.5" form factor is application-ready and off-the-shelf deployable in small to mid sized series in combination with any congatec SMARC Computer-on-Module available to date.