Search results for "Congatec"
congatec simplifies Arm deployments with i.MX 8M Plus
congatec announces that its SMARC Computer-on-Modules based on NXP i.MX8 M Plus processor technology have achieved SystemReady IR certification within the Arm driven Cassini project.
Intertraffic Amsterdam: congatec
congatec, a vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.
Congatec simplifies COM-HPC designs
Congatec a vendor of embedded and edge computing technology – welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.
World premiere for x86 based COM-HPC Server
congatec, a vendor of embedded and edge computing technology, celebrates the world premiere for x86 based COM-HPC Server modules by announcing the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D.
A quantum leap in core count
congatec – a vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules.
Round-the-clock accessibility provided by congatec
congatec has opened a digital trade show booth as a permanent exhibition on their website, providingadditional learning opportunities for potential customers who are unable to attend trade fairs and exhibitions due to the pandemic,
Congatec introduces real-time over the air platform
Congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices
Computer-on-Modules meet functional safety and security
congatec has announced its strategic partnership with SYSGO to create Computer-on-Modules meet functional safety and security
Design guide suits COM-HPC specification
PICMG, a consortium for developing open embedded computing specifications, announces that the COM-HPC Carrier Board Design Guide is released and freely available on the PICMG website.
Ultra-rugged Intel Core modules with soldered RAM
congatec has introduced new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40 to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.