Search results for "igbt"

ROHM Semiconductor will debut its latest power product designs atPCIM, the leading trade fair for Power Electronics, Intelligent Motion and Energy Management in Nuremberg, from May 16 – 18, 2017 (Hall 9, Booth 316).Energy savings and reduced system costs in all kinds of systems are heavily influenced by choosing the right power device.

Releasing the new FHC1 and FHC2 Series power film capacitors, AVX Corporation has designed them especially for Electric and Hybrid Electric Vehicle (EV/HEV) applications.Exhibiting high ripple current capabilities, extremely high dielectric strength in operating conditions up to 115°C, low inductance, low ESR, and a low thermal footprint, the new FHC Series capacitors deliver high-reliability performance that compliments and protects high-pow...

Nordson DAGE, Nordson MATRIX and Nordson YESTECH, divisions of Nordson Corporation will be exhibiting at the SMT/Hybrid/Packaging exhibition in Nuremberg (May 16-18). Nordson DAGE will demonstrate their flagship system – the new Quadra 7 with 0.1μm sub-micron feature recognition which comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50μm pixel pitch and 6.7MP image size of the Aspire FP detector.

The STNRGPF01 SMPS (Switched-Mode Power Supply) controller from STMicroelectronics delivers the flexibility and high efficiency of digital power without the technical challenges and time to develop custom DSP (Digital Signal Processor) code. ST will showcase a 3kW industrial SMPS evaluation board featuring the STNRGPF01 at its booth at APEC 2017, March 26-30, in Tampa, Florida.

Power densities are increasing three times or more in many applications as the demand for more power in electronics continues to increase, while the space allowable for power continues to decrease. This increase in power has the collateral effect of producing more heat. More heat traditionally results in the use of higher capacity fans and bigger heat sinks to prevent overheating of the electronic components and system failure.

Infineon Technologies has expanded its offering of 62 mm IGBT modules. The new power modules serve the growing demand for higher power density without increasing package size. This is realised by a larger chip area and an adapted DCB substrate in the proven 62 mm package. Typical applications for modules with 1200 V blocking voltage are drives, solar inverters and uninterruptible power supply (UPS) as well as medium voltage drives for modules wit...

Distributor Rutronik has presented a highly-compressible Thermal Interface Material (TIM) from Panasonic, the Soft-PGS. Its 200µm thickness guarantees thermal stability up to 400°C with thermal conductivity up to 400W/mK. Soft-PGS is a 200µm thick graphite sheet designed for use as a thermal interface material for IGBT modules.

At APEC 2017 in Tampa, Florida (March 27-29), Richardson RFPD will highlight a wide range of innovative technologies from the world's leading suppliers of applied power electronics solutions. Featured on the company stand will be ADI drivers for wide bandgap technologies, featuring low propagation delay and cost/size reductions versus opto-coupler solutions, and Astrodyne EMI filters (single-phase, 3-phase, DC, COTs and custom designs) for virtua...

A family of power IGBTs in the new VINco E3 package from Vincotech are available at Richardson RFPD with full design support capabilities. The VINco E3 package features SLC (SoLid Cover) technology in an industry-standard low-profile package. It enables engineers to design mid-power inverters with higher output current, higher power density and improved reliability for motion control, industrial drives, solar power, UPS and other mid-power applic...

Linear Technology introduces the LTM9100 µModule(micromodule), all-in-one Isolated Anyside switch controller protects and monitors high voltage DC power supplies up to 1000V. High voltage supplies used in industrial, datacom, avionic and medical applications require a controlled turn-on, with isolation needed for control circuit protection, operator safety and breaking ground paths. Alternative relay-based or discrete solutions are bulky, c...