Search results for "chiplet"

Advantest Corporation will showcase its latest test solutions atSEMICONJapan 2024 on Dec. 11-13 at the Tokyo Big Sight in Tokyo, Japan.

RED Semiconductor has won a place to join the semiconductor industry’s highly acclaimed Silicon Catalyst Incubator programme.

At electronica 2024, X-FAB announced its latest collaboration with SMART Photonics to drive photonics innovations within datacom, telecom and beyond.

More power, more energy-efficiency, more complexity – manufacturers of modern microchips are constantly facing new challenges, especially regarding the electrical connections required.

Themed‘Innovation and Collaboration: Powering Sustainable Exponential Growth’,SEMICON Europa2024will gather industry experts 12–15 November 2024 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management, and workforce.

SEMICON Europa 2024 will gather industry experts November 12-15 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management and workforce.

SEMICON Japan opens 13th Dec. at Tokyo Big Sight with more than 900 exhibitors from 19 regions showcasing their latest products and technologies.

SignatureIP, the pioneer ofnext generation interconnect and interfacesolutions, announces that its Networks-on-Chips (NoCs) provide the necessary infrastructure to efficiently connect and manage RISC-V CPUs in complex chip designs.

Nearfield Instruments B.V., a provider ofprocess control metrology solutionsfor advanced semiconductor devices, has launched ‘Lightning Mode’, a new feature for QUADRA, which is the semiconductor industry’s highest-throughput atomic force microscopy (AFM) metrology system for advanced semiconductor devices.

Siemens Digital Industries Software has introduced Calibre 3DThermal, innovative software for thermal analysis, verification, and debugging in 3D integrated circuits (3D-ICs).