Search results for "chiplet"

Siemens Digital Industries Software has announced that South Korea-based nepes corporation, which delivers Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D IC packages.

Empower Semiconductor, the global integrated voltage regulators (IVRs) specialist, will exhibit its latest generation of IVRs at the IEEE Applied Power Electronics Conference and Exposition (APEC), taking place at the Long Beach Convention and Entertainment Centre, 25–29February 2024.

Semiconductor industry weekly update. Dolphin Design marks success with 12nm FinFET silicon tape-out

Partnership enables Alphawave Semi to bolster their custom silicon and chiplet solutions with proteanTecs’ lifecycle health and performance monitoring.

Yole Group is set to participate in the Chiplet Summit 2024, taking place from February 6-8that the Santa Clara Convention Centre.

As the automotive industry leans towards software-enabled autonomous, connected, and electric vehicles, cyber security is emerging as a new benchmark of quality.

Valens Semiconductor and Intel Foundry Services (IFS) announce that IFS will fabricate Valens Semiconductor’s MIPI A-PHY chipsets using its advanced process nodes, aiming to address the robust demand in the market for this innovative connectivity solution.

Intel has announced plans at CES 2024 to drive the company’s AI everywhere strategy into the automotive market, including a deal to acquire Silicon Mobility, a fabless silicon and software company that specialises in SoCs for intelligent electric vehicle (EV) energy management.

Cadence Design Systems has acquired Invecas, a provider of design engineering, embedded software and system-level solutions, headquartered in Santa Clara, California.

Synopsys and SiMa.ai have announced a strategic collaboration to jointly deliver a new solution for automotive companies to accelerate the development of workload-specific silicon and software needed to power artificial intelligence-enabled features in next-generation automobiles.