Search results for "TSMC"
Atrenta Ships 5.0 Release of SpyGlass Platform
Atrenta announced today the 5.0 release of its SpyGlass RTL analysis and optimization platform. This is also the first unified release of the SpyGlass and GenSys platforms. The release contains extensive enhancements for performance, accuracy and usability, and many are the direct result of customer feedback.
IC Insights Announce 7% Semiconductor R&D Spending Rise Despite Weak Market
Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion, according to the 2013 edition of IC Insights’ McClean Report. The increase lifted R&D spending by chip companies to 16.7% of total semiconductor sales in 2012, the highest level since the peak of 17.5% was reached in both 2008 and 2009.
Five IC Suppliers to Hold One-Third of 300mm Wafer Capacity in 2013
It is a fact that semiconductor industry capital spending is becoming more concentrated with a greater percentage of spending coming from a shrinking number of companies. As a result, IC industry capacity is also becoming more concentrated and this trend is especially prevalent in 300mm wafer technology.
Cadence Expands IP Portfolio with Agreement to Acquire Cosmic Circuits
Cadence Design Systems today announced an agreement to acquire Cosmic Circuits Private Limited. Cosmic Circuits offers silicon-proven IP solutions in connectivity and advanced mixed-signal technologies in the 40nm and 28nm process nodes, with 20nm and FinFET development well underway.
Synopsys Contributes PyCell Technology to the IPL Alliance
Synopsys today announced that it has contributed the specification and definition of Python PCell (PyCell) API technology to the IPL Alliance. The contribution will benefit the custom design community by allowing IPL member companies to be directly involved in the evolution of the Interoperable Process Design Kit (iPDK) standard.
Xilinx Stays a Generation Ahead with Multiple 20nm Firsts
Xilinx announced today three major milestones in the execution and introduction of its next generation 20nm All Programmable Devices. The 20nm portfolio builds upon Xilinx breakthroughs proven at 28nm to provide an extra generation of system performance, lower power and programmable system integration. The 20nm portfolio will address a wide range of next generation systems and provides the most compelling programmable alternative ever to ASICs an...
China’s IC Market Growth Continues To Outpace Its IC Manufacturing
China’s IC market is forecast to continue growing at a strong rate through 2017—faster than the growth rate of the worldwide IC market—according to IC Insights’ latest forecast contained in the pages of The 2013 McClean Report. The Chinese IC market is forecast to have a 2012-2017 compound annual growth rate of 13%, five points higher than the 8% CAGR forecast for the total IC market during this same time period.
Kalray announces the first public demonstration and commercial availability of its MPPA 256-core processor at the HiPEAC Conference in Berlin
Kalray today announced the availability of the first batch of functional and running 28 nanometer MPPA 256 processor targeting high performance, low power embedded applications as well as high performance computing. Following its bold strategy based on leading edge architectural choices and patent protected technologies, Kalray pursues its trajectory to success by demonstrating at the HiPEAC conference in Berlin (Jan 21 to 23rd), a series of app...
Kilopass First to Demonstrate Antifuse Non-Volatile Memory IP With Successful Test Chips on TSMC 20nm Process
Kilopass Technology have today announced that its NVM IP is the first antifuse technology to achieve successful test chips on TSMC’s 20nm process. Analysis of the test chips containing Kilopass NVM IP memory modules validated manufacturability, process control tolerance and cell programming characteristics.
Atrenta and TSMC Announce SpyGlass IP Kit 2.0 Availability
Atrenta, with TSMC, have announced today the planned availability of IP Kit 2.0. Based on the SpyGlass RTL design platform, IP Kit is a fundamental element of TSMC’s soft IP9000 Quality Assessment program that assesses the robustness and completeness of soft, or synthesizable IP.