Search results for "TSMC"

Siemens Digital Industries Software has announced, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using Siemens advanced packaging integration solutions.

Synopsysannounces its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.

Siemens Digital Industries Software announces it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications, and innovative technology enablement for the foundry’s newest process technologies.

EnSilica has announced that it has joined the Design Center Alliance (DCA) of TSMC Open Innovation Platform (OIP).

Alphawave Semi has launched the industry's first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.

Avnet ASIC has announced that it has launched its new low-power design services for TSMC's 4nm and below process technologies.

Siemens collaborates with TSMC on design tool certifications for the foundry’s newest processes and other enablement milestones.

Synopsys will host its annual flagship user group conference, SNUG Silicon Valley, 19-20thMarch 2025, at the Santa Clara Convention Center. This year, the first day of SNUG will also feature an inaugural, invite-only Synopsys Executive Forum.

Data centres and HPC servers are expected to grow gradually in the next years. Both applications are strongly driven by AI. Although the traditional server and networking markets have been weak during 2024, AI servers are growing strongly.

Appleis once again the world’s most valuable brand. Brand Finance, the brand valuation consultancy, values Apple’s brand at $574.5 billion for 2025, keeping it ahead of its closest rival, Microsoft, valued at $461 billion.