Search results for "TSMC"

See Altera successfully demonstrate 32 Gbps transceiver performance on 20 nm silicon developed on TSMC's 20SoC process technology. These 20 nm transceivers feature the lowest power consumption, fastest timing closure, and superior signal integrity needed for the most demanding applications.

Next month, IC Insights’ April Update to The 2013 McClean Report will show a ranking of the 2012 top-50 semiconductor suppliers; a preview of the top-25 companies is listed in Figure 1. The top 25 worldwide semiconductor (ICs and O S Ds—optoelectronics, discretes, and sensors) sales leaders for 2012 include 10 suppliers headquartered in the U.S., seven in Japan, three in Taiwan, three in Europe, and two in South Korea, a relatively broad repr...

IC Insights’ soon-to-be-released March Update to The 2013 McClean Report lists the forecasted 2013 top-25 semiconductor capital spenders with a preview of the top-10 spenders listed in Figure 1. As shown, there are five companies that are expected to spend at least $3.0 billion in 2013, the same as in 2012 and 2011.

ARM and Synopsys announce availability of optimized 28-nanometer Synopsys Reference Implementations for ARM Cortex-A15 MPCore and Cortex-A7 MPCore processor clusters as well as the CoreLink CCI-400 cache-coherent interconnect. The companies collaborated to deliver these optimized implementations in TSMC 28HPM process technology using the Synopsys Galaxy Implementation Platform, ARM Artisan standard cells and memories, and ARM POP technology for c...

More than one quarter of installed wafer capacity worldwide is dedicated to producing IC devices using process geometries (or feature sizes) smaller than 40nm, according to data in IC Insights’ Global Wafer Capacity 2013—A Detailed Analysis and Forecast of the IC Industry’s Wafer Fab Capacity.

Altera Corporation today reaffirmed their commitment to a long-term partnership to set new milestones in FPGA innovation. TSMC is Altera's primary foundry, supplying a wide array of processes to fulfill Altera's product portfolio, including soon-to-be released 20 nm products, existing mainstream products, and long-lived legacy components.

Oasys Design Systems revealed today that it has joined the TSMC Soft-IP Alliance Program to enable TSMC IP partners with a new RTL exploration tool to improve quality of results and reduce the iterations required for design closure.

At the Mobile World Congress, imec and Target Compiler Technologies announced that they have extended their strategic collaboration on ASIP designs in the field of mobile communication. One of the achievements endorsing their fruitful collaboration in the past years is a new multi-standard LDPC FEC ASIP architecture template for multi-Gbps wireless communication.

AnSem NV announces the availability of a flexible and low power Analog Front End (AFE) for power line communication (PLC) in the lower frequency bands. The ANS6201 is a single chip Analog Front End built in 0.18µm TSMC technology that integrates all main blocks, including filters, for a narrowband OFDM PLC transceiver.

According to Yole Développement, “In the semiconductor industry, there are different ways of managing the technology evolution and doing business”. Indeed, key players like Intel are at the forefront of technological developments and adapt their capabilities by introducing new production lines. Such companies have vast financial resources for in-house development.