Search results for "thermal"

Paige West speaks with Philip Simpson, Field Application Engineer, Vicor about the power dynamics of Remotely Operated Vehicles (ROVs).

Toshiba has launched a motor control driver IC that implements a gate driver and a CPU core together with a comprehensive set of features and capabilities for driving three-phase brushless DC (BLDC) motors and permanent magnet synchronous motors (PMSM) more efficiently.

Diamfab, a semiconductor diamond deeptech, has announced a first round of funding of €8.7 million, from Asterion Ventures, the French Tech Seed fund managed on behalf of the French government by Bpifrance as part of France 2030, Kreaxi with the Avenir Industrie Auvergne-Rhône-Alpes regional fund, Better Angle, Hello Tomorrow, and Grenoble Alpes Métropole.

Nisshinbo Micro Devices Inc. has unveiled the NJW1871 series, a new Boost/Fly-Back Switching Regulator Controller, aimed at catering to the needs of small to medium-sized power supplies across consumer, industrial, and automotive sectors.

STMicroelectronics unveiled the ST4E1240 RS-485 transceiver, having a 40Mbit/s speed, PROFIBUS-compatible output, and protections against transient and hot-swap incidents.

Axiomtek introduces the CEM320, a new addition to its range of COM Express Type 10 modules, featuring optimised processing and graphics performance with low power consumption.

The semiconductor industry continually pushes packaging technology boundaries to meet the demand for higher chip performance and efficiency.

How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose.

Concluding Europe's largest ever research initiative to date, the Graphene Flagship officially wrapped up at the end of last year and has left an indelible mark on material science and research innovation.

Powered by Intel’s latest Elkhart Lake processors, the new compact form-factor AAEON PICO-EHL1 is ideally suited to digital signage, industrial automation and edge computing applications. Designed to deliver energy efficiency and robust thermal management capabilities, the PICO-EHL1 can operate reliably in harsh environments and excels in applications where power consumption and heat dissipation are key considerations.