Search results for "thermal"
Marelli showcases design innovation at Beijing Auto Expo
Marelli, a mobility technology supplier to the automotive sector, will showcase its latest innovations at the Beijing International Automotive Exhibition, in booth W1-W01 of the temporary hall, in Beijing, China, April 25 – May 4, 2024.
Gaming, computer accessories and other related products
TME explores its range of PC gaming accessories and latest products on offer in its catalogue.
Advancements in silicone elastomers enhance soft robotics manufacturing
Researchers at Rice University have made strides in the field of soft robotics by developing an analytical model that precisely predicts the curing time of platinum-catalysed silicone elastomers based on temperature.
ENNOVI introduces new flexible circuit production process
ENNOVI has introduced a more advanced and sustainable way of producing flexible circuits for low voltage signals in EV battery cell contacting systems.
DC power supplies premiere at embedded world 2024
The latest DC power supplies from Rohde & Schwarz are for every-day manual use in the laboratory as well as for automated applications.
Würth Elektronik presents new anti-sulphur resistors
Würth Elektronik presents its new family of more than 500 WRIS-RSKS Anti-Sulphur resistors whose outstanding feature is their resilience to sulphur.
Improving the thermal performance of BLDC motor controllers in automotive applications
Brushless direct-current (BLDC) motors are efficient, can operate at high speeds, and are easy to control.
Game-changing solutions at Ceramics Expo
No matter where you sit on the advanced manufacturing supply chain, discover game-changing solutions at Ceramics Expo.
New Vishay 80V symmetric dual MOSFET
New Yorker Electronics has introduced Vishay’s new 80V symmetric dual n-channel power MOSFET that combines high and low side TrenchFET Gen IV MOSFETs in a single 3.3mm by 3.3mm PowerPAIR 3x3FS package.
Indium Corporation’s Sze Pei Lim at ICEP Japan
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP Japan 2024).