Search results for "thermal"
Laird Thermal Systems new line of micro thermoelectric coolers
Laird Thermal Systems launches the OptoTEC MBX Series, a line of micro thermoelectric coolers for high-performance space-constrained optoelectronic applications.
CTX Thermal Solutions at electronica 2024
CTX Thermal Solutions will present its broad portfolio of solutions for efficient thermal management at electronica in Munich from November 12 to 15, 2024.
Start of training at Rehm Thermal Systems
Every autumn, thousands ofschool leaversin Germany start a dual vocational training programme, laying the foundations for their professional future.
Laird Thermal Systems showcases active cooling technologies at CIOE 2024
Laird Thermal Systems, the global manufacturer of thermal management solutions, will be exhibiting at the 2024 China International Optoelectronic Exhibition from 11–13 September 2024 at the Shenzhen World Exhibition and Convention Centre.
Laird Thermal Systems acquires Tark, Inc.
Laird Thermal Systems has acquired Tark, Inc., a specialised pump and cooling solution provider for the medical and industrial CT and X-Ray tube industry.
Custom-tailored thermal management from CTX
CTX is offering custom-tailored and project-specific solutions for thermal management of all power electronics applications.
Laird Thermal Systems launches the SuperCool X series
Laird Thermal Systems has launched a new high-performance thermoelectric cooler assembly series that utilises next-generation thermoelectric coolers with advanced semiconductor materials.
The Rehm Technology Days 2024 – where the future meets technology
Traditionally, theRehmTechnology Days offer a valuable opportunity for knowledge exchange, networking, and discussion.
Effective cooling of hot spots with liquid-cooled heat sinks
Liquid-cooled heat sinks are used in applications where passive or fan-based cooling solutions are insufficient, but effective cooling is indispensable.
Parker Chromerics releases new thermal gap filler
The Chromerics Division of Parker Hannifin Corporation has released THERM-A-FORM CIP 60, a high-performance cure-in-place material and thermal gap filler that offers 6.0 W/m-K thermal conductivity.