Search results for "thermal"

Concluding Europe's largest ever research initiative to date, the Graphene Flagship officially wrapped up at the end of last year and has left an indelible mark on material science and research innovation.

Powered by Intel’s latest Elkhart Lake processors, the new compact form-factor AAEON PICO-EHL1 is ideally suited to digital signage, industrial automation and edge computing applications. Designed to deliver energy efficiency and robust thermal management capabilities, the PICO-EHL1 can operate reliably in harsh environments and excels in applications where power consumption and heat dissipation are key considerations.

Ricardo has played a key role in assisting Greenjets in developing the inaugural generation of an electric, fully operational demonstrator propulsion module named InCEPTion, designed for aircraft under five tonnes.

Ventec International Group has announced its plans to unveil new products aimed at enhancing signal integrity and thermal performance, alongside introducing new services at the IPC APEX Expo 2024, scheduled for 9-11thApril at booth #4309.

CTX expands its line of SMD heat sinks. In addition to standard SMD heat sinks for all common D-PAK modules, the leading supplier of custom cooling solutions now also offers extruded and cold extruded aluminum SMD heat sinks that are designed and produced for the exact thermal requirements.

Infineon Technologies has unveiled its SSO10T TSC package, incorporating OptiMOS MOSFET technology.

In the most recent instalment of the Vicor Powering Innovation podcast, the topic of electrification was thoroughly examined through a conversation with Lightning Motorcycles

Neousys Technology has expanded its lineup of industrial computers resistant to water with the introduction of the Nuvo-9650AWP series.

congatec, a provider of embedded and Edge computing technology, welcomes the publication of COM-HPC Carrier Design Guide Rev. 2.2, which provides developers with performance specifications and a source of inspiration for the layout of modular designs on the basis of the small 95 x 70mm COM-HPC Mini specification.

Kontron, a global provider of IoT/Embedded Computer Technology (ECT), is presenting its KBox B-201-RPL and KBox B-202-RPL Embedded Box PCs with powerful Intel Core processors of the 14th generation at embedded world 2024 in Nuremberg.