Search results for "chiplet"

What will the E/E (electrical/electronic) architecture in thevehicle of tomorrowlook like? And what requirements will this place on thesemiconductorsused?

Alphawave Semi has launched the industry's first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.

Breaking the high-end packaging market down by end markets, the largest segment is telecom and infrastructure, which accounted for over 67% of the revenue in 2023.

Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.

Alphawave Sem has announced the successful tape-out of the industry's first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC's 7nm process.

Alphawave Semi has expanded its strategic partnership with Samsung Foundry. The expanded agreement encompasses leading-edge IP for PCI Express 7.0, 112G and 224G Ethernet and the latest UCIe (Universal Chiplet Interconnect Express) die-to-die interconnect standard that is enabling next-generation SoC (system-on-chip) technologies for AI and other HPC systems.

In his speech, "Building Sustainable, AI-Ready Cloud Data Centers with Arm Neoverse," Eddie Ramirez, Vice President of Marketing, Infrastructure Line of Business at Arm, highlighted the exponential growth of AI workloads across various industries and its impact on energy consumption.

Honda has announced that it and IBM have signed a Memorandum of Understanding (MoU) outlining their intent to collaborate on the long-term joint research and development of next-generation computing technologies needed to overcome challenges related to processing capability, power consumption, and design complexity for the realisation of the software-defined vehicles (SDV) of the future.

Socionext has announced a collaboration with Arm and TSMC for the development of a power-optimised 32-core CPU chiplet in TSMCʼs 2nm silicon technology, delivering scalable performance for hyperscale data centre server, 5/6G infrastructure, DPU and Edge-of-network markets.

Empower Semiconductor unveiled a new partnership agreement with Dimac Red Spa, a sales and engineering firm dedicated to providing the European market with high-reliability electronic products, alongside design and engineering services.