Search results for "TSMC"

Synopsys has announced that its GalaxyDesign Platform enables 90% of the production tapeouts of FinFET-based designs. The company has also highlighted the use of its Galaxy Design Platform byHiSilicon Technologies,for the implementation of ARMCortex-A72, Cortex -A57 and Cortex -A53 processor-based FinFET designs targeting TSMC's 16nm process technology.

Cadence Design Systems and ARM have jointly announced the availability of a complete SoC development environment, supporting the ARM premium mobile IP suite that incorporates the latest ARM Cortex-A72 processor, ARM Mali-T880 GPU and ARM CoreLink CCI-500 Cache Coherent Interconnect solution.

ARM today announced a suite of IP that will enable a new standard for premium experiences on 2016 mobile devices. At the heart of this suite is the ARM Cortex-A72 processor, which is claimed to be the highest performing CPU technology available for developing mobile SoCs today. In target configurations, the Cortex-A72 processor will deliver CPU performance that is 50X greater than the leading smartphones from just five years ago.

A medium density NVM IP family, which fills the gap between lower bit count NVM and flash memory, without requiring additional masks or processing steps, has been released by Synopsys. The DesignWare medium density NVM IP family provides up to 64 Kb of on-chip memory and eliminates the need for external EEPROM or flash memory when integrating MCUs in analogue IC designs for smart sensors, power management and touchscreen controller applications. ...

Dolphin Integration’s sponsored offering at TSMC 55nm uLP and uLPeF meets the demands of fabless IC suppliers for solutions that enable high performance SoCs with a low power consumption. A number of the company’s products complement the 55nm uLP/uLPeF.

An IP macro, which meets the demands of IoT devices and Zettabyte traffic, has been successfully tested by Semtech. Operating at 25Gb/s and beyond, the snowPHY-C2 platform IP provides lane breakouts in 2x25G (for 50Gb/s), 4x25G (for 100Gb/s) and 8x25G (for 200Gb/s) form factors.

Based on the company's 'Global Wafer Capacity 2015-2019' report and 'The McClean Report 2015', IC Insights has provided a ranking of the industry’s largest IC manufacturers in terms of installed 300mm wafer start capacity in 2014, in Figure 1 - below. Included in the list are four companies from North America, four from Taiwan, two from South Korea, and one from Japan (two companies tied for the #10 position).

Designed for fabless and SoC integrators targeting the growing smart grid related markets, such as utility billing meters and smart plugs, Dolphin Integration has released the Metro-PM-Jade-mono.05 silicon IP.The silicon IP, featuring a complete measurement subsystem for single-phase power metering ICs, is available in main technological processes at 130nm.

Keysight Technologies has the latest release of its powerful Advanced Design System (ADS) software, ADS 2015. Featuring silicon RFIC interoperability with Cadence’s Virtuoso, GoldenGate-in-ADS, and a host of capabilities intended to increase design efficiency, the Keysight EEsof EDA software, ADS 2015, is changing how silicon RFIC and multi-technology module design is performed.

ARM and TSMC have announced a multi-year agreement that will deliver ARMv8-A processor IP optimised for TSMC 10FinFET process technology.Due to the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early pathfinding work will provide valuable learning to enable physical design IP and methodologies to tape-out 10FinFET designs in late 2015.