Search results for "TSMC"

Sally Ward-Foxton investigates how more advanced process nodes are enabling performance enhancements in the latest-gen FPGA products.

At 2014's IEEE International Electron Devices Meeting, imec demonstrated the industry’s first integrated graphene optical Electro-Absorption Modulator (EAM) capable of 10Gb/s modulation speed. Combining low insertion loss, low drive voltage, high thermal stability, broadband operation and compact footprint, the device marks an important milestone in the realisation of next-gen, high-density low-power integrated optical interconnects.

TSMC is leading the way in revenues per wafer among the top four pure play semiconductor foundry companies. A report from IC Insights finds that the revenue per wafer start (expressed in 200mm equivalents) varies considerably among foundry companies (Figure 1). TSMC’s revenue per wafer is forecast at $1,328 in 2014 outpacing GlobalFoundries by 27%.

The top 20 worldwide semiconductor sales ranking for 2014 includes eight suppliers headquartered in the US, three in Japan, three in Europe, three in Taiwan, two in South Korea, and one in Singapore says IC Insights This year’s top-20 ranking includes two pure-play foundries (TSMC and UMC) and six fabless companies.

Cadence Design Systems, Inc announced that its digital and custom/analog tools have achieved V0.9 Design Rule Manual (DRM) and SPICE certification from TSMC for its 16FF+ process, enabling systems and semiconductor companies to take advantage of the 15 percent speed improvement with the same total power compared to 16nm FinFET, or 30 percent total power reduction at the same speed compared to 16nm FinFET. 16FF+ V1.0 certification is on track to b...

To enable the rapid development of IoT and wearable devices, Cadence and ARM are updating 55ULP, 40ULP and 28ULP TSMC process technologies. Together, the companies will integrate ARM Cortex processors, ARM CoreLink system IP and ARM Artisan physical IP along with RF/analogue/mixed-signal IP and embedded flash in the Virtuoso-VDI Mixed-Signal Open Access integrated flow for theTSMC process technology.

Due to its low leakage, the standard cell library from Dolphin Integrations has been chosen by Enverv to enable smart metering applications. Compared to a HVT library operating at 1.2V, the SESAME BIV library reduces leakage by 1/350.

Samsung recently announced plans to build a new, cutting-edge wafer fab—a $14.7 billion investment for the company that will be located in Pyeongtaek, a city south of Seoul. The new fab, slated to begin production in 2H17, will add to Samsung’s current impressive compilation of wafer fabs (Figure 1) as it seeks to maintain its leading position in memory IC sales and expand its system leadership beyond smartphones, Smart TVs, and table...

Cadence has revealed that TSMC has adopted the company's solutions for 16nm FinFET library characterisation. Based on Cadence Virtuoso Liberate characterisation solution and Spectre circuit simulator, the library characterisation tool setting includes environment setup and sample templates for TSMC standard cells.

FeaturingTSMC’s 55nm embedded flash process technology, theMAX 10 FPGAs have been introduced by Altera. TSMC's technology enables the non-volatile FPGAs to provide dual-configuration flash, analogue and embedded processing capabilities in a small-form-factor, low-cost, instant-on programmable logic device.