Search results for "chiplet"

What’s new:in its debut at Auto Shanghai, Intel unveiled the second-generation Intel AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC), the automotive

Alphawave Semi is pleased to participate in this year's Optical Fiber Communications Conference & Exhibition (OFC).

imec, a research and innovation hub in nanoelectronics and digital technologies, and the State Government of Baden-Württemberg, Germany, have announced the launch of the Advanced Chip Design Accelerator (ACDA).

Sarcina Technology announces the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements.

Baya Systems has announced its new NeuraScale switch fabric technology designed to overcome critical scaling and data movement challenges in AI infrastructure that are driving advanced SoCs and emerging 3D chiplet-based designs. As AI workloads demand unprecedented levels of performance, throughput, and efficiency, traditional crossbar switching architectures are struggling to keep pace.

Arteris has introduced FlexGen, a smart network-on-chip (NoC) interconnect IP. FlexGen from Arteris dramatically accelerates chip development while optimising performance efficiency, addressing the rising demand for faster, more sustainable innovation in automotive, datacentre, consumer electronics, communications, and industrial applications.

The Public Authorities Board of the Chips Joint Undertaking (EU Chips Act) has awarded funding to the APECS pilot line project. The project is part of a major effort to develop European semiconductor production. The project focuses on developing and providing new packaging and integration solutions for the industry. VTT is also involved in the following pilot line projects aiming at semiconductor production: FAMES, NanoIC, and PIXEurope.

Data centres and HPC servers are expected to grow gradually in the next years. Both applications are strongly driven by AI. Although the traditional server and networking markets have been weak during 2024, AI servers are growing strongly.

EXTOLL, a provider of high-speed and ultra-low-power SerDes and chiplet connectivity, has been selected byBeammWaveas a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX.

Honda Motor and Renesas Electronics announce that they have signed an agreement to develop a high-performance system-on-chip (SoC) for software-defined vehicles (SDVs).