Search results for "tsmc"

Cadence Design Systems has revealed the results of a three-way collaboration with TSMC and Microsoft focused on utilising cloud infrastructure to reduce semiconductor design signoff schedules.

Synopsys has announced that its collaboration with TSMC and Microsoft has delivered a highly scalable timing signoff flow for use in the cloud. This extensive, multi-month collaboration among the three industry partners speeds up the path to signoff next-generation systems-on-chips (SoCs).

Imagination Technologies has announced the launch of IMG iEW400, its latest IP based on Imagination’s Ensigma WiFi 6 technology. iEW400 delivers integrated RF and baseband, designed for low-power and battery-powered applications such as the internet of things (IoT), wearables and hearables.

Agile Analog has announced that they have worked with EnSilica, to both fabricate and test their latest analogue IP products, and to validate that their advanced product delivery processes provide maximum benefit to Agile Analog’s end customers.

Rambus has expanded its portfolio of high-speed interface IP on TSMC’s 7nm process with the addition of its silicon-demonstrated 112G XSR/USR PHY. Offering unmatched power and area efficiency for next-generation applications, the 112G XSR/USR PHY is a critical enabler of chiplet and CPO architectures for data centre, networking, 5G, HPC and AI/ML applications.

Agile Analog has announced that they have worked with EnSilica, to both fabricate and test their latest analogue IP products, and to validate that their advanced product delivery processes provide maximum benefit to Agile Analog’s end customers.

In their forecasts at the end of last year Leadership Group members of the Electronic Components Supply Network (ecsn) and International Distributors of Electronics Association (IDEA) predicted that our industry might have to contend with a number of fairly major political upheavals in 2020, as the US steps up export regulations again. Many these upheavals could seriously restrict growth in the global electronic components markets,

Providing voice neural networks integration for MCUs, CEVA has announced that its CEVA-BX DSP cores and WhisPro speech recognition software targeting conversational AI and contextual awareness applications now also support TensorFlow Lite for Microcontrollers, a production ready, cross-platform framework for deploying tiny machine learning on power-efficient processors in edge devices.

STMicroelectronics and TSMC are collaborating to accelerate the development of Gallium Nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market. Through this collaboration, ST’s innovative and strategic GaN products will be manufactured using TSMC’s leading GaN process technology.

Xilinx has announced Versal Premium, the third series in the Versal ACAP portfolio. The Versal Premium series features highly integrated, networked and power-optimised cores and a high bandwidth and compute density on an adaptable platform.