Search results for "tsmc"
Siemens delivers certified and automated design flows for TSMC 3DFabrictechnologies
Siemens Digital Industries Software has announced, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using Siemens advanced packaging integration solutions.
Synopsys and TSMC Pave the path for trillion-transistor AI and multi-die chip design
Synopsysannounces its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.
Siemens and TSMC to advance integrated circuit and systems design
Siemens Digital Industries Software announces it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications, and innovative technology enablement for the foundry’s newest process technologies.
EnSilica joins TSMC Design Center Alliance
EnSilica has announced that it has joined the Design Center Alliance (DCA) of TSMC Open Innovation Platform (OIP).
Alphawave Semi launches 3nm UCIe IP with TSMC CoWoS packaging
Alphawave Semi has launched the industry's first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.
Avnet ASIC low-power design services for TSMC
Avnet ASIC has announced that it has launched its new low-power design services for TSMC's 4nm and below process technologies.
Siemens collaborates with TSMC on design tool certifications
Siemens collaborates with TSMC on design tool certifications for the foundry’s newest processes and other enablement milestones.
TechInsights releases analysis of NVIDIA Blackwell
TechInsights has released early-stage findings of its teardown analysis of the NVIDIA Blackwell HGX B200 platform delivering advanced artificial intelligence (AI) and high-performance computing (HPC) performance in the data centre.
SiPhIA launches three special interest groups
The SEMI Silicon Photonics Industry Alliance (SiPhIA) held the Bridging Light & Silicon: SEMI SiPhIA SIGs Kick-off & Seminar, announcing the official launch of three Special Interest Groups (SIGs) aimed at integrating expertise from various sectors to formulate industry standards and accelerate technological innovation and commercialisation.
IDTechEx explores the packaging technologies behind the world's first 3D-stacked CPO from NVIDIA
At GTC 2025, NVIDIA announced two new networking switch platforms – Spectrum-X Photonics and Quantum-X Photonics – based on co-packaged optics (CPO) technology.