Combining small size and large current density, the Nano-Fit and Ultra-Fit power connectors have been released by Molex. These wire-to-board connectors are particularly suitable for consumer/home appliance, networking and telecommunications, industrial, and automotive/commercial vehicle applications.

Featuring a compact 3.56mm pitch and delivering a frequency range of DC to 65GHz, SMPM RF Blind-Mate Connectors from Molex are designed for high density computing and telecomms applications. MIL-PRF-39012 compliant, the connectors are suitable for aerospace and defence applications requiring optimal frequency performance.

  The CLPA (CC-Link Partner Association), a worldwide body that develops and promotes the open automation networks CC-Link and CC-Link IE, has appointed Molex as a board member.

  With compression contacts that eliminate hand soldering and simplify the LED installation process, SlimRay Pre Wired LED Chip-on-Board (CoB) Array Holders reduce assembly time while increasing reliability, Molex has announced.

3D technology, which combines the versatility of the two-shot MID moulding process with the speed and precision of LDS, has been introduced by Molex. While meeting stringent medical grade guidelines, the MediSpec Moulded Interconnect Device/Laser Direct Structuring (MID/LDS) technology delivers integrated fine-pitch 3D circuitry in a single moulded package suitable for high density medical devices.

Molex has received a 2014 Chicago Innovation Award for developing the connector system that brings electrical connectivity to the Dow Chemical Company’s POWERHOUSE Solar Shingles. The Molex Interconnect System helped enable Dow to deliver its solar roofing solution to residential consumers across the U.S. and in Canada.

The push-to-lock mating feature of the Brad MX-PTL M12 cordset from Molex makes it easy to use, with industry-standard M12 receptacles and much less twisting required than traditional threaded connectors. End users, including machine builders, integrators and OEMs, simply push the cordset into a female M12 receptacle to meet IP65 Ingress Protection on their connections.

Designed to minimise impedance discontinuities in high-speed military and aerospace data and telecomms devices that are intended for use in harsh environments, the Rigid Flex Circuits and Assemblies have been released by Molex. The assemblies feature the company’s rigid flex circuitry which combine the benefits of flexible copper circuitry and rigid PCB circuitry into a single power and signal solution to provide higher reliability at ...

Claimed to provide mobile device manufacturers with a highly versatile connector that offers a lower profile and more compact size than competitive products, the microSD/micro-SIM combo connector has been released by Molex. Featuring a 2.28mm height with detect switch, the push-pull, normal-mount combo connector saves space by combining two card functions in one. This eliminates the need for an extra sub-PCB. 

Designed for use in high port-count gigabit switches and routers, Molex has announced the introduction of PoE+ Enabled Gigabit Multi-port Magnetic RJ45 modules. Available in 8- (2x4) and 12-port (2x6) versions, the magnetic RJ45 modules provide gigabit data and enable delivery of PoE+ 30W power to networked end devices.

Molex has launched its Hermetic-Sealed Multi-Fibre Circular MT Optical Assemblies, delivering extreme sealing performance in the industry’s smallest footprint. The MT Optical Assemblies provide system reliability in extreme environments, including severe weather conditions, high altitudes and high atmospheric pressures. These conditions can cause ordinary surveillance and sensor equipment to fail, which can create critical communicatio...

Designed to connect industrial controllers to I/O devices in harsh-duty environments, the Brad HarshIO IP67 Compact Ethernet Modules have been released by Molex. Measuring 30mm, the modules can be configured as inputs or outputs with M8 or M12 connectors, making them suitable for attaching sensing devices or actuators.

A coiled assembly that enables hot swapping connections in removable media applications such as hot swapping within storage drawers has been launched by Molex. The ResilientFlex coiled assembly supports high speed signal transmission applications (such as SATA, SAS, etc.,) requiring flexible, expandable packaging for high-signal frequencies demanding tight impedance control and 12.0 Gbps data rates and beyond.

Introduced by Molex, 3.96mm pitch EdgeMate Wire-to-Edgecard power connectors eliminate the need for mating headers, enabling cost and time savings. Featuring a positive locking mechanism that can hook onto a PCB and ensure the terminals mate to card contacts, this system is suitable for use in high shock and vibration environments.

A flat ribbon cable, claimed to be the only solution on the market which meets the MIL-Spec M49055/11 and M49055/12 requirements for harsh environment applications, has been released by Molex. To allow the Temp-Flex cable to withstand exposure to chemicals, extreme temperatures, abrasions and flexure, the company utilised an extruded FEP (Fluorinated Ethylene Propylene) dielectric insulation material rather than PVC or TPE (Thermoplastic Elastome...

At the SPS IPC Drives 2014, Molex will be exhibiting it’s Brad SST Communication Modules designed for Rockwell ControlLogix. The company will present the SST-PB3S-CLX-RLL, SST-PB3S-CLX-RLL-CC and SST-PB3S-CLXT-RLL modules in hall 10, booth 110 at the event which takes place on 25 -27 November 2014, in Nuremberg, Germany.

At SPS IPC Drives 2014, Molex will present a range of Ethernet switches for plant floor and industrial automation network applications. The Brad Direct-Link harsh-duty unmanaged Ethernet switches provide a secure on-machine Ethernet connection, which helps reduce complex network cabling, lower network costs and eliminate common wiring errors.

Designed to deliver 5Gb/s, a series of USB 3.0 panel-mount receptacles and overmoulded cordsets has been introduced by Molex. Compared to the company's USB 2.0 line, the panel-mount receptacles and cordsets deliver data speeds which are 10 times faster. The receptacles and cordsets, which are industrial-rated, are engineered to USB 3.0 standards.

The CDFP Multi-Source Agreement is pleased to release specifications for the CDFP 2.0 interoperable hot pluggable modules. Designed for resource intensive applications in telecommunications, networking and enterprise computing environments, the CDFP interface enables data rates of 25 Gbps over 16 lanes for an aggregate of 400 Gbps on a single module with excellent signal integrity, thermal cooling properties, and EMI protection.

Drop-in replacements for industry-standard connector systems, Molex has introduced the rugged ML-XT sealed connection system. The system accommodates a vast range of sensor technologies and low circuit count functions and is suited for critical vehicle wiring applications in harsh environments.