Expanding its line of Woodhead Watertite wet-location wiring solutions, Molex has introduced three FD multiple outlet boxes with closure plugs and reducers. Available in single-, two- and three-gang configurations to provide greater flexibility, the outlet boxes offer greater depth and provide 30% more volume than traditional FD boxes (according to Molex).

In order to ease automatic vacuum pick-and-place processes on PCBs, Molex has added Kapton tape to its family of vertical SMT modular jacks. By adding a Kapton tape surface to the top side of the connector, the  modular jacks streamline high-volume production and lower manufacturing costs in industries such as telecomms, consumer, medical, industrial and commercial.

Form-fit-function replacements for the previous generation devices, Molex has announced the second generation Brad applicomIO PROFIBUS Network Interface Cards (NICs). These devices deliver a communication solution to acquire deterministic real-time data from I/O devices connected to the PROFIBUS DP protocol used by robotic manufacturers, complex machine builders, system integrators and end users.

Featuring 0.35mm pitch, the ultra-low profile SlimStack SSB6 SMT microminiature Board-to-Board (BTB) connectors have been unveiled by Molex. With a compact size of 0.60x2.00mm, when mated, the connectors save space in the compact packaging of smartphones and other portable mobile devices, as well as a wide range of surgical, therapeutic and monitoring medical devices.

Designed to allow design engineers more options and improved performance, Molex Incorporated has introduced its DDR4 DIMM sockets in both aerodynamic and standard versions. The aerodynamic socket features a through hole termination style and streamlined latch and housing feature for better airflow and space-savings. The standard version features three termination styles: press-fit for solderless processes, surface mount technology for e...

Offering high density performance with data-rates up to 40Gbps, Molex has revealed that its Impel backplane connector system is available for use with the company's Backplane Pin Map Configurator. This future-proof connector solution offers a migration path for enhancements in the same chassis through Impel daughtercard options.

A free online tool for backplane product design has been released by Molex. The Backplane Pin Map Configurator is designed to shorten time-to-market, guiding users through a series of inputs to identify backplane parameters and generate a pin map for their backplane application. The tool is available free on the Molex website.

A sealed connector system has been launched by Molex. The MXP120 Sealed Connector System is a 4.00mm pitch connection system based on 1.20mm terminals for automotive and commercial vehicle in-line harness applications. Meeting medium power application requirements up to 13.0A, the MXP120 can replace common 1.50mm systems to achieve a smaller, more compact solution.

Mega-Fit® Power Connectors deliver cutting-edge current density at 23.0A per circuit; terminals provide six independent contact points for long-term reliability in virtually every industry and application.

Molex has recently launched its new fully customisable Plastic Optical Fibre (POF) assemblies and harnesses designed to offer a rugged and cost-effective solution to provide maximum flexibility for optical cabling in a vast number of industrial, medical, transportation, renewable energy, smart grid, electrical & hybrid vehicles, consumer, sensors and imaging applications.

Molex has announced the launch of its new comprehensive iPass+ High-Density Interconnect System, comprised of host-side board connectors, internal and external copper cable assemblies and Active Optical Cables (AOCs) capable of transporting SAS 3.0, 12 Gbps signals in lengths up to 100 meters. The enhanced iPass+ HD system is designed and engineered to meet the new performance standards for speed and density.

Molex Incorporated has announced that its comprehensive SL (Stackable Linear) Modular Connector System is available in tape-and-reel packaging with pick-and-place vacuum caps. The updated system enables the use of an automated termination procedure to facilitate high-speed processing and accurate placement on the printed circuit board (PCB).

The interface of the recently released Molex Incorporated zCD active optical cable (AOC) interconnect solution has been selected by CDFP MSA as the interface for the consortium’s 400Gbps hot pluggable module. Scalable up to 400 Gbps, the zCD interconnect is ideal for high bandwidth telecommunications, networking and enterprise computing data signalling rates.

Molex has announced the signing of a binding agreement to acquire Flamar Cavi Elettrici, designer and manufacturer of a broad range of custom cables for multiple markets and applications. Flamar will operate as a subsidiary of Molex Incorporated. The acquisition is subject to anti-trust approval and is expected to close in Q3 2014. Terms were not disclosed.

Designed to replace stiff, semi-rigid assemblies, Flexible Microwave Cable Assemblies combine Temp-Flex coaxial cables and high-performance RF connectors. Introduced by Molex, the assemblies offer excellent electrical properties, and are assembled using a proprietary technique that minimises Voltage Standing Wave Ratio and insertion loss for a complete end-to-end interconnect solution.

Molex has announced an innovative LED Array Holding concept for LED lighting manufacturers using chip-on-board technology. With the Molex Prewired Holder concept, the wires no longer need to be inserted at the holder during assembly - they are an integral part of the holder, providing maximum wire-to-holder retention forces.

A Plastic Substrate Interconnect (PSI) for LED CoB Arrays has been launched by Molex. The customisable interconnects feature a low-profile harness interface that delivers power to the array through a simple and reliable connection to a holder, or plastic substrate. Substrate costs are minimised due to the low overall package height of ~2.00mm, with the slim design suiting space-limited applications.

Providing 30% more wiring space over FS boxes, Woodhead Watertite non-metallic FD boxes are NEMA- and IP66-rated for harsh industrial conditions, available in one-, two- and three-gang configurations for future system expansions.

The heavy-duty connector business of Westec s.r.l. has been acquired by Molex European Holdings BV, a subsidiary of Molex Incorporated. Based in Milan, Italy, Westec’s business consists of the manufacturing of more than 6,000 products, including a wide range of junction boxes, multi-pole connectors, and connector assemblies designed for automation, robotics and other harsh-duty industrial applications.

Molex has revealed that its VersaBeam expanded beam ferrule technology and single-mode silicon photonic active optical products will support the MXC fibre optic interface. Molex joins a user community of diverse suppliers supporting the cutting-edge MXC interface targeted to meet projected demand in next-generation ‘disaggregated’ rack server and computing architectures.