Molex and Neoconix have developed a flexible copper high-density and speed (HD&S) interposer in a tool-less, easy-to-use configuration. Available now, Molex’s FlexBeam Tool-Less Copper Flex Interposer is a low-profile, flex-to-board interface that provides densities of 1.00mm (.039”) or less in a variety of pin-matrix configurations. The combination of Molex’s high speed copper flex assembly integrated with Neoconix’s ...

Molex has introduced the latest addition to its Impact backplane connector family of products, Impact 85 Ohm, to meet the growing demands of next generation server, storage and data networking equipment. Molex’s new Impact 85 Ohm connector system is designed to support the Intel Quick Path Interconnect (QPI) standard, PCI Express Generation 2.0 and 3.0, as well as any proprietary system design where 85 Ohm differential impedance is desired.

Molex has introduced EdgeLine, a family of one-piece, low-cost connectors supporting high-speed signal transmissions using a card edge interface and a vertical or right angle insertion. Molex’s EdgeLine 12.5 Gbps Edge Card and CoPlanar connectors are a flexible and scalable solution for a wide variety of low- to mid-range telecom, computing, and storage applications.

Molex has announced that its HSAutoLink cable connection system fully supports the new 1394 Trade Association Automotive specification The new specification, which was introduced in July last year, extends the original IDB- 1394 Automotive Standard that stipulates the use of optical media to include operation over cabling media.

Molex Incorporated will present several demonstrations showing its newest and highest performing interconnect solutions at DesignCon 2009, which is held in Santa Clara, CA, 2nd - 5th February. During this year’s show, visitors to the Molex stand (booth 511) will discover all the latest advances and innovations in interconnect design technology. An impressive array of leading-edge products will be on show, as well as the opportunity to speak...

Molex and Amphenol TCS (ATCS) have signed a cross license / second-source licensing agreement that gives ATCS the right to manufacture, market and sell the I-Trac Backplane Connector System worldwide. Molex is pleased to announce this latest development in the Molex-ATCS relationship,” said Martin Slark, Chief Executive Officer of Molex. “The technology behind our I-Trac design offers users unmatched versatility and performance. By pa...

Molex has introduced Sealed SFP Assemblies in response to customer demands to incorporate SFP transceivers into sealed panel mounted receptacles. These new solutions also meet a market need for upgrades from a copper Ethernet system to an optical transceiver, or can interchange between the two as requirements demand.

The new universal Electro Magnetic Interference (EMI) adapter from Molex gives users the ability to change one half of the optical interface to suit specific applications, while maintaining all functionality and performance benefits of a standard optical adapter.

Said to be unique to the market, the new 1.27mm (0.050) Picoflex discrete wire connectors from Molex are ideal for power applications up to 2.4A at 250V as well for many signal applications. They comply fully with the stringent glow wire requirements of IEC 60335 and are therefore a convenient and cost effective choice for use in appliances and systems that are likely to operate unattended.