Companies

Infineon Technologies AG

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.

Infineon Technologies AG Articles

Displaying 861 - 880 of 927
Power
7th September 2011
New Infineon Automotive Power Management 40V P-Channel OptiMOS P2 Chips Improve Energy Efficiency and Save Costs with EPS, Motor Control and Electric Pumps

Infineon Technologies AG introduced its latest family of single P-channel 40V automotive power MOSFETs produced using advanced trench technology. The new 40V OptiMOS P2 products strengthen Infineon’s leadership in power management for next-generation automotive applications by setting new benchmarks in improved energy efficiency, reduced CO2 emissions and cost savings.

Analysis
15th August 2011
RELY Research Project: New Ways of Chip Design Methodology

Germany’s foreign trade success is determined to an ever-increasing degree by the quality and reliability of high-tech products. Seven partners from the German business and research communities are teaming up in the three-year “RELY” project to explore ways of enhancing the quality, reliability and resilience of modern microelectronic systems. The focus will be on applications in transportation, in particular electromobility, in medical tec...

Analysis
10th August 2011
European e-BRAINS Research Project Lays the Foundations for the Integration of Heterogeneous Systems Using 3D and Nanotechnology

September 2010 saw the launch of the European e-BRAINS (Best-Reliable Ambient Intelligent Nano Sensor Systems) research project in which Infineon Technologies AG is joining forces with 19 partners to conduct research into the integration of heterogeneous systems. Led by Infineon and Fraunhofer EMFT (Fraunhofer Research Institution for Modular Solid State Technologies), for the technical management, the project will run until the end of 2013. Nano...

Automotive
10th August 2011
Infineon Extends its XC2000 Automotive Microcontroller Family: New Low-End Devices Enable Body, Safety and Powertrain Solutions with 32-Bit Performance at 8-Bit Costs

Giving the medium-sized and compact car category access to the safety and convenience applications of the premium segment and enabling their compliance with the strictest fuel consumption and pollutant emission requirements, Infineon Technologies AG today announced the cost-optimized extension of its successful XC2000 automotive microcontroller portfolio. Enabling 32-bit equivalent performance at 8-bit costs the new 16-bit devices address low-end...

Sensors
10th August 2011
HONEY Lays the Cornerstone for Highly Complex Driver Assistance Systems in Medium-Sized Vehicles; HONEY Research Project Successfully Concluded

Even today, a medium-sized vehicle contains about 1,000 chips and as many as 80 networked electronic systems. These numbers are set to grow as state-of-the-art safety technology gains traction – for example, driver assistance systems that help to prevent hazards such as rear-end collision in fog. The tight design envelope of a car means that existing systems have to become ever smaller and new ones have to be as compact as possible. This is whe...

Design
10th August 2011
RELY Research Project: New Ways of Chip Design Methodology

Germany’s foreign trade success is determined to an ever-increasing degree by the quality and reliability of high-tech products. Seven partners from the German business and research communities are teaming up in the three-year “RELY” project to explore ways of enhancing the quality, reliability and resilience of modern microelectronic systems. The focus will be on applications in transportation, in particular electromobility, in medical tec...

Wireless
4th August 2011
World’s Smallest Integrated Receive Front-End Modules BGM103xN7 Series from Infineon for GPS and GLONASS Applications Now Available

Infineon Technologies has introduced a new series of Receive Front-End Modules for implementation of Global Navigation Satellite System (GNSS) functionality in Smart Phones and other handheld devices. The new BGM103xN7 Series devices are the first modules available that support separate or simultaneous reception of both Global Positioning System (GPS) and Globalnaya Navigatsionnaya Sputnikovaya Sistema (GLONASS) signals.

Design
7th July 2011
Infineon Extends its XC2000 Automotive Microcontroller Family: New Low-End Devices Enable Body, Safety and Powertrain Solutions with 32-Bit Performance at 8-Bit Costs

Giving the medium-sized and compact car category access to the safety and convenience applications of the premium segment and enabling their compliance with the strictest fuel consumption and pollutant emission requirements, Infineon Technologies AG today announced the cost-optimized extension of its successful XC2000 automotive microcontroller portfolio. Enabling 32-bit equivalent performance at 8-bit costs the new 16-bit devices address low-end...

Design
7th July 2011
HONEY Lays the Cornerstone for Highly Complex Driver Assistance Systems in Medium-Sized Vehicles; HONEY Research Project Successfully Concluded

Even today, a medium-sized vehicle contains about 1,000 chips and as many as 80 networked electronic systems. These numbers are set to grow as state-of-the-art safety technology gains traction – for example, driver assistance systems that help to prevent hazards such as rear-end collision in fog. The tight design envelope of a car means that existing systems have to become ever smaller and new ones have to be as compact as possible. This is whe...

Power
23rd May 2011
Infineon - EconoPACK + D Family IGBT Modules for Highest Demands Posed by Wind and Solar Systems and Industrial Drives

Infineon Technologies presents the EconoPACK + D family, the latest generation of power semiconductor modules in the 1200V and 1700V voltage classes with up to 450A nominal current, at the PCIM Europe 2011 (May 17-19) in Nuremberg, Germany. Infineon has developed the new EconoPACK™ + D series based on the well-known and established EconoPACK™+ platform to master the ever-growing demands in applications such as renewable energies, commercial v...

Power
23rd May 2011
Infineon - New RC-Drives Fast IGBTs Enable Up To 96% Energy Efficiency with High Switching Frequency While Reducing the Inverter Size and Cost

At PCIM Europe (May 17-19) in Nuremberg, Germany, Infineon expanded its family of Reverse Conducting (RC) 600V IGBT with two new switching power devices that achieve up to 96% efficiency in target applications. The new RC-Drives Fast devices allow design of energy efficient, electric-motor driven consumer appliances that use smaller components and thus have a lower overall cost compared to alternative systems.

Power
23rd May 2011
Infineon`s 650V CoolMOS CFD2 Technology with Integrated Fast Body Diode Said to Take Energy Efficiency in Applications like Servers, Solar, Telecom SMPS and Lighting to the Next Level

With its latest generation of high-voltage CoolMOS MOSFETs Infineon is rolling out another innovation setting new standards in the field of energy efficiency. At the PCIM Europe 2011 (May 17-19) in Nuremberg, Germany, Infineon presents the new 650V CoolMOS™ CFD2 – the world`s first high-voltage transistor with both a drain-source voltage of 650V and an integrated fast body diode. The new CFD2 devices succeed the 600V CFD products, enabling no...

Power
23rd May 2011
Infineon - 4.5kV IGBT Modules Increase Energy Efficiency and Reduce Switching Losses

Infineon's 4.5kV IHV modules integrate IGBT3/EC3 chips optimized for use in traction drives and high-voltage DC transmission (HVDC). HVDC technology delivers the capability for extremely efficient long-distance electric power transmission. Thanks to the elevated current density of modules incorporating IGBT3/EC3 chips, more power can be transmitted and higher output can be achieved without altering the existing design or needing a more powerful c...

Analysis
23rd May 2011
Infineon First Semiconductor Supplier to Offer “80 PLUS Platinum” Compliant Computing Silver Box Reference Design

Infineon Technologies has developed the first marketable silver box reference design that enables PC and server power supply units to achieve up to 92.35 percent efficiency, while significantly reducing the material costs. Infineon’s solution IFX90ATX300W is based on the latest generation of three ICs (Integrated Circuits) and meets the industry’s highest energy efficiency standard: “80 PLUS® Platinum”. Efficiency indicates what share of...

Sensors
28th April 2011
Infineon Introduces Industry’s First Signature Watchdog Device CIC61508 Enabling ASIL-D Approved Safety Applications With Its 32-Bit Microcontrollers

Infineon Technologies AG today announced its intelligent Signature Watchdog CIC61508. In combination with the company’s powerful 32-Bit TriCore microcontrollers and the dedicated SafeTcore software, the CIC61508 can provide monitoring features compliant up to the highest risk level of functional safety according to the IEC61508 and ISO26262 automotive industry standards. The CIC61508 is a safety watchdog which can be integrated into safety rele...

Design
20th April 2011
RESCAR 2.0 Enhances the Robustness of Electronic Automotive Components; Major Step on the Path to Becoming a Leading Electromobility Supplier

Whether in the powertrain, in central control units or in body and convenience electronics – there is a constant increase in the proportion of electronic components used in the car. This trend is accompanied by growing complexity of the systems installed, meaning that designers are forever faced with new challenges in the fine tuning. Six partners from all levels of the development chain have now joined forces in a quest to come up with overarc...

Analysis
11th April 2011
German Research Project V3DIM Lays the Foundations in 3D Design for the Extremely High Frequency Millimeter-Wave Range

The “V3DIM” research project lays the foundations for working out the design requirements to develop innovative, highly integrated 3D System-in-Package (SiP) solutions for systems in the extremely high frequency range of 40 to 100 GHz, the so-called millimeter-wave range.

Analysis
9th March 2011
Infineon to Establish New Entity in China Meeting the Growing Demand for Energy Efficiency and Electromobility Solutions

Infineon Technologies AG today opened a new facility in China called Infineon Integrated Circuits (Beijing) Co., Ltd., located in the Beijing Economic and Technological Development Area. In addition to sales and marketing, application R&D and central functions, the new entity houses an IGBT stack manufacturing facility and a technical center for automotive solutions. IGBTs (Insulated Gate Bipolar Transistors) are power semiconductors used to driv...

Tech Videos
9th March 2011
Security chips for sensitive data from Infineon Technologies

The high-tech company Infineon Technologies AG, headquartered in Neubiberg near Munich, Germany, offers semiconductor and system solutions for security, energy efficiency and mobility. In our digital world security is more essential than ever. Infineon's latest innovation, the Integrity Guard security technology, sets the global benchmark in this segment.

Automotice Microsite
27th January 2011
Volkswagen to Use Infineon Sensor Chip in Electric Power Steering Systems

Infineon Technologies AG today announced that in future the Volkswagen AG Business Unit Braunschweig will use Infineon’s Hall sensors in electric power steering systems for vehicles. Infineon’s TLE4998C4 programmable linear Hall sensor will be used for various model ranges. Infineon has already started to deliver the chips.

First Previous Page 44 of 47 Next Last

Featured products

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier