Infineon today announces the expansion of its SiC portfolio with the introduction of the 650V thinQ! SiC Schottky Barrier Diodes Generation 5. Infineon’s proprietary diffusion soldering process, already introduced with Generation 3, is now combined with a new, more compact design as well as latest advancements in thin wafer technology bringing improved thermal characteristics and a Figure of Merit (Q c x V f) in the order of 30% lower with ...

Infineon and NXP Semiconductors are investigating how future generations of electronic identification documents can be made more secure and efficient. The three companies form the German consortium of the “New P@ss” research project funded by the Federal Ministry of Education and Research, in which a total of 15 companies from five EU countries are taking part.

Only security chips from Infineon Technology are installed in Continental’s new generation of digital tachographs VDO DTCO. With Infineon chips, the company can efficiently implement the high security standards set by the European Union (EU) in 2009 for such systems. Infineon supplies Continental with a security controller, which is certified according to “Common Criteria EAL5+ high” and allows reliable authentification in digital tachograp...

Infineon Technologies AG today announced that it received a 2011 Technical Development Award from the automotive system supplier Denso Corporation. Denso recognized Infineon for its development of a specific tire pressure sensor chip which enables Denso to realize a more cost effective system and supports built-in autolocation. The Tire Pressure Monitoring System (TPMS) sensors of Infineon support direct systems, where the tire pressure is measur...

Infineon Technologies AG presents the second generation of its embedded power (ePower) devices. The new TLE983x System-on-Chip (SoC) product family integrates a powerful 8-bit microcontroller with a LIN transceiver and related peripherals on a single chip to address the needs of space and cost sensitive automotive body applications. The new devices are specifically designed to fit to a wide range of LIN-slave motor control applications where a sm...

The KP200 pressure sensor from Infineon Technologies AG plays an important role in increasing the protection of pedestrians and car occupants in the event of a collision. The pressure sensor is used in a new safety system that the automotive system supplier Continental AG has developed in collaboration with a well known automobile manufacturer. The first generation of the system is already being used in various premium vehicles. Continental chose...

Infineon Technologies AG today announced it has shipped its two billionth sensor and thus belongs amongst the world’s leading providers of semiconductor-based magnetic sensors and pressure sensors. Infineon believes itself to be the world market leader in sensors for example for pressure sensors used in side airbag systems and for magnetic sensors used for wheel speed measurement in anti-lock braking systems, enjoying market shares of around 50...

Infineon Technologies AG today introduced the latest generation of its High Speed CAN transceivers designed for automotive network applications: the TLE7250 family comprising the TLE7250G and the TLE7250GVIO. While the TLE7250G interfaces with 5V microcontrollers, the TLE7250GVIO has a voltage reference input, enabling either a 5V or a 3.3V microcontroller I/O interface. Compared to the previous generation, the new transceivers offer improved imm...

Infineon Technologies AG today introduced a new family of 32-bit multicore microcontrollers that serves the requirements for powertrain and safety applications of the automotive industry. The multicore architecture of the new AURIX family features up to three independent 32-bit TriCore processor cores to meets the highest safety standards in the industry while doubling performance compared to currently available best-in-class devices.

Andi Guan talks about the impact of smart grids on electricity costs and the future role of consumers.

In the real-time MCU world, cost-effective complex motor control designs have been dominated by specialized cores. In many cases dual-core systems have been used, with the main core handling the control algorithm and a second “mini” core managing the real-time I/O and data manipulation. By Mike Copeland, Senior Staff Applications Engineer, Infineon Technologies.

Infineon Technologies AG and Fairchild Semiconductor Corp. today announced a licensing agreement on Infineon’s advanced automotive MOSFET packaging technology H-PSOF (Heatsink Plastic Small Outline Flat Lead), a JEDEC standard TO-Leadless package (MO-299).

Infineon Technologies expands its Automotive power semiconductor lineup with the new 650V CoolMOS CFDA. This is the industry’s first Superjunction MOSFET solution with Integrated Fast Body Diode to meet the highest Automotive qualification standard AEC-Q101. The 650V CoolMOS CFDA is particularly designed for resonant topologies such as battery charging, DC/DC converters and HID (High Intensity Discharge) Lighting, also in hybrid and electric ve...

Infineon Technologies enhanced its online design solution Infineon Light Desk, adding additional features and the support for a new series of AC/DC off-line LED drivers.

Infineon Technologies today introduced an innovative package technology providing high-current capability and high efficiency for demanding automotive electronics applications, including electric and hybrid vehicles. The new TO package is compliant with JEDEC standard H-PSOF (Heatsink Plastic Small Outline Flat lead). The first available products using the H-PSOF package technology are 40V OptiMOS T2 power transistors offering up to 300A current ...

Infineon Technologies AG today introduced automotive qualified 100 percent lead-free power MOSFETs for TO package types. Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS T2 power MOSFETs offer best-in-class specifications. Infineon uses a diffusion soldering die attach approach to produce the lead-free packages that include TO-220, TO-262 and TO-263. Because of specifi...

Infineon Technologies AG now offers 32-bit microcontrollers of the AUDO MAX family with integrated security hardware. The new AUDO MAX SHE microcontrollers extend the tamper-proofing of electronic control units (ECU) and protect against tuning, for example. AUDO MAX SHE enables automotive manufacturers to ensure the integrity of their ECUs and to guard better against exposure to liability claims. Today three products of the AUDO MAX family come w...

Infineon Technologies AG and Bombardier Transportation have entered into a strategic partnership in the field of drive electronics for advanced rail vehicles. The agreement envisages the supply of semiconductor components by Infineon to Bombardier in the course of the coming five years. These power semiconductors enable energy-efficient control of electric motors in locomotives, high-speed trains, underground and urban railways. Infineon will ens...

Infineon Technologies AG today introduced its 32-bit microcontroller (MCU) multicore architecture. The new architecture is the foundation of Infineon’s next generation MCU family that will fulfill the requirements of upcoming automotive powertrain and safety applications. The multicore architecture features up to three processor cores to share the application load, introduces lockstep cores and contains further enhanced hardware safety mechanis...

Infineon Technologies AG today announced that Hyundai Motor Company and Kia Motors Corporation have selected Infineon as supplier of power modules for their current hybrid car generations, the Hyundai Sonata Hybrid and Kia Optima. Hyundai and Kia, together the world’s fastest-growing and fifth-largest car manufacturer, teamed up with Infineon on the hybrid powertrain design including the Infineon HybridPACK™1 power module and the related cont...