The trends toward higher power density and cost optimisation dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies today announced it has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are ideal for high-voltage MOSFETs as a JEDEC standard. 

Over 100 representatives from 39 companies and 23 research institutions are meeting in Munich at the Campeon, headquarters of Infineon Technologies AG, for the kick-off of the European research initiative PowerizeD. They are focusing on intelligence in power electronics and thus want to contribute to the decarbonisation of European society and the protection of our climate.  

Led by Infineon Austria, the European research project "Listen2Future" started with 27 partners from seven countries to develop new and smallest microphone and ultrasound sensors for examinations in industry and medicine. Precise mini hearing aids, fast infection controls for infants or wearable ultrasound patches have now become possible.  

For the third consecutive year, Infineon Technologies has successfully defended its market leading position as MEMS microphone supplier.

Infineon Austria is leading 27 partners from seven countries in Listen2Future, a new 30m Euro European research project to develop new and smallest microphone and ultrasound sensors for examinations in industry and medicine.

Long-lasting music playback performance that comes in compact, cost-effective, and power-efficient designs, is indispensable, especially for battery-powered applications. Infineon Technologies AG recently introduced its latest generation of MERUS multilevel Class D audio amplifiers. Several ecosystem partners of Infineon are now ready to support customers with their design-in efforts. The company aims to boost the adoption of the new technology b...

Infineon Technologies is selling its hybrid and custom board-based power products to Micross.

Infineon Technologies and Altia have announced that Infineon’s TRAVEO T2G Cluster microcontroller (MCU) family will be enabled by the Altia CloudWare software platform for display applications in early 2023.

Infineon Technologies and Green Hills Software will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

The European collaboration project Power2Power has been successfully completed. Over the past three years, 43 partners from industry and research jointly developed novel power semiconductors with higher power density and energy efficiency.

Infineon Technologies has announced that it will highlight the company’s contributions to mitigate climate change and enable digital transformation at CES 2023.

Infineon is adding the XMC7000 series to its microcontroller portfolio. The new MCU family includes a single- or a dual-core Arm Cortex-M7 core, both with Arm Cortex-M0+ support.

Infineon Technologies has been named a CES 2023 ‘Innovation Awards Honouree’ for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.

Infineon in cooperation with pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C.

Commercial production of integrated circuits using 28nm technology node began several years ago. As the process technology has matured, market demand for 28nm products has also increased. Although offering numerous advantages, security applications have not been among the main applications of this technology, thus far. Infineon Technologies is introducing SLC26P, the first security IC targeting high volume payment applications based on the future...

Infineon Technologies and TSMC announced the companies are preparing to introduce TSMC’s Resistive RAM (RRAM) non-volatile memory (NVM) technology into Infineon’s next generation AURIX microcontrollers (MCU).

Quantum computers could become a serious threat to the security of documents such as electronic passports before the present decade is over. New, quantum-secure encryption methods help protect stored biometric data.

Infineon Technologies and Fingerprint Cards announced the signing of a joint development and commercialisation agreement of a plug-and-play turnkey solution for biometric payment smart cards. The goal of the cooperation is to make biometric smart card production as simple and easy as producing a standard dual interface payment card.

Infineon Technologies has added EasyPACK 4B to its Easy power module family.

Infineon Technologies has added EasyPACK 4B to its industry-leading Easy power module family.