Infineon is updating its expectations for revenues and Segment Result Margin for the running, second quarter as well as for the full 2023 fiscal year. This is primarily based on resilient business dynamics in its core automotive and industrial segments.

Infineon have announced its AIROC CYW20829 Bluetooth LE system on chip (SoC) is ready with the newly released Bluetooth 5.4 specification. 

Infineon and Delta Electronics are expanding their long-term cooperation from industrial to automotive applications. Both companies signed a Memorandum of Understanding that will deepen their joint innovation activities to provide more efficient and higher-density solutions for the fast-growing market of EV.

At APEC 2023, Infineon Technologies announced the company is joining forces with Infinitum. In this technology collaboration, Infineon will provide silicon carbide (SiC) CoolSiC MOSFETs and other key semiconductor components that greatly contribute to the Infinitum motor system’s motor control.

The development of secure systems is critical for the automotive market. The Rust programming language, with its built-in support for memory-safe software development, is an important enabler for the design of mission-critical automotive software.

Infineon Technologies have announced the launch of their new AIROC CYW43022 dual-band Wi-Fi 5 and Bluetooth combo.

Decarbonisation and digitalisation are the two defining challenges of our time. However, one cannot be achieved without the other. At Embedded World 2023 in Nuremberg, Germany, Infineon will demonstrate both its power solutions and IoT portfolio of sensors, actuators and microcontrollers. 

They will be the heart of automated connected vehicles: high-performance computers built into the car, processing all the available data and information as quickly and reliably as possible, so that the vehicles can make their way safely through traffic, says Infineon.

Infineon Technologies is acquiring Ottawa-based GaN Systems for US$830 million.

Decarbonisation and digitalisation are the two defining challenges of our time. However, one cannot be achieved without the other, Infineon explores.

Smart wearables and IoT devices are becoming increasingly popular for a variety of applications as they offer more functionality despite severe space and power constraints. By adding NFC capabilities to wearables, they can be used to pay in stores or gain access to public transportation and office buildings.

Infineon, in collaboration with 3D time-of-flight partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family.

Making payments at the beach or while playing sports will become increasingly convenient in the future, as more and more everyday objects such as watches, rings, key fobs and even items of clothing gain the ability to conduct payment transactions. As the market leader for security semiconductors, Infineon is now driving this development forward with its SECORA Connect portfolio. New, robust chips whose smallest versions are less than half the siz...

Lighting accounts for a significant portion of the world's total electricity consumption, emphasising the importance of energy-efficient solutions in this sector. 

Infineon has launched the SEMPER Nano NOR Flash memory optimised for battery-powered, small-form-factor electronic devices. Emerging wearable and industrial applications, including fitness trackers, hearables, health monitors, drones, and GPS trackers, enable more with precision tracking, critical information logging, enhanced security, noise cancellation, and more.

In cooperation with Infineon, TrustSEC, a leader in information security and smart cards, has launched its advanced smart cards operating system (OS) BIO-SLCOS.

IoT technologies have the potential to overcome many of the challenges society faces today. Even more, they improve the quality of life, convenience and increase industrial productivity.

German President Frank-Walter Steinmeier visited Infineon Technologies in Kulim, Malaysia, as part of his trip to Asia. The visit focused on Infineon's contribution to enabling the global energy transition with energy-saving semiconductor solutions, as well as by investing in solutions that further reduce the CO 2 footprint in its chip manufacturing.

Infineon Technologies has finished its 23rd Annual General Meeting. The entire event was held in a virtual format and broadcast publicly on the company web site. Shareholders had the opportunity to speak live during the event and ask questions.

Infineon Technologies AG is starting construction of its new plant for analogue/mixed-signal technologies and power semiconductors. After extensive analysis, the Infineon Management Board and supervisory bodies gave the green light for the Dresden site. The German Federal Ministry for Economic Affairs and Climate Action has approved an early project launch, meaning that construction can already begin before completion of the inspection of legal s...