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IXYS will showcase a variety of its new developments at the Power Conversion Intelligent Motion exhibition in Nuremberg, Germany between the 14th and the 16th May 2013. The PCIM Show in Germany is well established as the premier meeting place for the global power electronic and power semiconductor industries and IXYS is taking the opportunity to present its latest developments in silicon technology as well as its packaging innovations.

An article from ES Design magazine providing a simple but innovative solution to adding current limiting to a voltage converter. By Matthias Ulmann, Reference Design Engineer worked in the EMEA Design Services Group at Texas Instruments.

Cree is introducing the industry’s first commercially available silicon-carbide six-pack power module in an industry-standard 45-mm package. When replacing a silicon module with equivalent ratings, Cree’s six-pack module can reduce power losses by 75 percent, which leads to an immediate 70 percent reduction in the size of the heat sink or a 50 percent increase in power density.

Cree has introduced the industry's first commercially available silicon carbide (SiC) six-pack power module in an industry standard 45mm package. When replacing a silicon module with equivalent ratings, Cree's six-pack module can reduce power losses by 75 percent, which leads to an immediate 70 percent reduction in the size of the heat sink or a 50 percent increase in power density.

ROHM Semiconductor will present its latest products and technologies at PCIM, the leading trade fair for power electronics in Nuremberg, from May 14 to 16 (Hall 9, Booth 211). The novelties offer beneficial characteristics resulting from latest material research, packaging and process know-how. They address the ever increasing demand for ultra-low energy consumption, miniaturization, reliability, reduced component count and costs while providing ...

Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive application at a European based IDM. The patent pending ecoAmp is a state-of-the-art solution for high-power applications of 1000+ amperes.

Next week at the PCIM 2013 trade show for power electronics, Infineon Technologies will present the new 2EDL EiceDRIVER Compact half-bridge gate driver, which is intended for applications with a blocking voltage of 600 Volts.

Vishay introduce a new high-performance metallized polypropylene film snubber capacitor. Configurable for direct mounting on insulated gate bipolar transistor modules, the Vishay Roederstein MKP386M features a wide capacitance range from 0.047 µF up to 10 µF, high-temperature operation to + 105 °C, and seven voltage ratings from 700 VDC to 2500 VDC and 420 VAC to 800 VAC.

IR engineering and sales staff will demonstrate IR’s latest energy-saving and high power density enabling technologies and products at the IR booth, Hall 9, Stand 413. The IR booth will feature the company’s latest power management solutions including a demonstration of its COOLiR technology for automotive, µIPM integrated modules and Gen8 IGBTs for motor control applications, and IR’s GaN-based power device platform, GaNpowIR.

IXYS Integrated Circuits Division announced the immediate availability of the IX4426, IX4427, and IX4428 low-cost dual low-side gate driver ICs. Each of the IX4426/7/8 outputs are capable of sourcing and sinking 1.5A, and they have a wide operating voltage range of 4.5V to 35V, which is much higher than competitive parts.