Search results for "igbt"

With a power rating of up to 16MW, a range of IGBT phase leg stacks has been introduced by IXYS. The standard, three-level, press-pack IGBT phase leg stacks are available at 3 voltages - 3.3kV, 6.6kV and 10kV.

Richardson RFPD is offering availability and full design support capabilities for RECOM Power’s high-isolation DC-to-DC converters. Designed specifically for insulated-gate bipolar transistor (IGBT) systems, the converters' asymmetric outputs of +15V and -9V make them ideal to power IGBT drivers, replacing the need for two converters.

Designed for use in motor control and power inverter applications, the ACPL-336J and ACPL-337J optocouplers have been announced by Avago. Avago claim that the highly-integrated smart gate drive optocoupler devices reduce system costs and board space, whilst improving overall power efficiency and reliability.

PCIM Europe 2014 feature a diverse conference program: from a total of 269 abstracts, the conference directors have put together a comprehensive program covering the latest technological trends in power electronics components and systems.

International Rectifier have announced that they havecommenced initial production at its new state-of-the-art ultra-thin wafer processing facility in Singapore (IRSG).

Expanding its 650V XPT IGBT product portfolio, IXYS has announced new IGBTs with current ratings of 16-200A. Supporting switching frequencies up to 60 kHz, the devices are targeted at applications including power inverters, uninterruptible power supplies, switch-mode power supplies, power factor correction circuits, battery chargers, welding machines, lamp ballasts, and E-Bikes.

Designed to improve the power cycling capabilities of power modules, top side solderable metallization has been introduced by IXYS on 200A and 300A, 650V Trench XPTTM IGBT silicon dies. Solderable top side replaces standard bond wire connections by using the standard soldering process, thereby improving power cycling capability and increasing the surge current capabilities of the dies.

The concept of hybrid and electric vehicles is far from new, but the challenges in the ascendance of the latest generation require new solutions. By Benjamin Jackson Senior Manager, Automotive Power Switch & Power Module, Product Management & Business Development, with International Rectifier.

The Hybrid Electric Vehicle is bringing new challenges and opportunities for power semiconductor packaging, in particular those without bond wires. Here we discuss how using discrete bond wireless building blocks in the CooliR2DIE approach can be used to develop a complete module. By Ben Jackson, Senior Manager, Automotive Power Switch & Power Module Product Management & Business Development, for International Rectifier.

Fairchild Semiconductor announce a new series of 1200 V field stop trench IGBTs which have been designed to meet the requirements of hard-switching industrial applications including solar inverters, uninterruptible power supplies, and welders. The FGH15T120SMD, FGH25T120SMD, and FGH40T120SMD IGBTs help power engineers achieve better efficiency and reliability in their designs.