Search results for "miniaturisation"
Just connect to a speaker for audio playback
Achieving simple audio playback via connection to a speaker, LAPIS Semiconductor, a ROHM Group Company, has introduced a low power MCU. The ML610Q304 integrates an 8-bit low power MCU core, speech synthesis circuit, high efficiency Class-D speaker amplifier, non-volatile memory and oscillator circuit on a single chip.
Sensors enhance miniaturisation with vacuum measurement
A line ofMEMS Pirani Vacuum Sensors, targeted at HVAC and industrial applications, has been introduced byPosifa Microsystems. Designated thePVC 1000 family, the sensors enhanceminiaturisation by employing avacuum measurement solution which is based on the principlethat the thermal conductivity of gases is proportional to pressure in the low vacuum range.
Demand for data is driving sensor innovation
Demand for more insightful data is helping drive innovation in sensor design. This a development that will benefit many markets, including Medical, according to Collette Johnson, Medical Business Development Manager, Plextek Consulting.
Updated rework products to be demonstrated at NEPCON South China
AtNEPCON South China in Booth A-1K25, Metcal will demonstrate theMX-500 Soldering and Rework System, HCT2-120 Hot Air Pencil and new features on the Scorpion.NEPCON South China isscheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center.
University of Glasgow spinout signs licensing deal
A University of Glasgow spinout company, which has developed technology to address the increasing challenges of silicon chip development, has signed a multimillion dollar deal with a major semiconductor foundry.Gold Standard Simulations (GSS) has announced a multi-million dollar contract to license its TCAD/EDA tool suite to GLOBALFOUNDRIES.
Power management challenges for wearable technology
The field of wearable technology is expanding rapidly but still faces challenges in power management. By Lauren Ofstedahl, Corporate Communications and Business Development Manager, Dialog Semiconductor.
Resistors achieve 100mΩ resistance in 0603 design
Low-ohmic chip resistors, optimised for current detection applications in compact equipment, have been developed by ROHM Semiconductor. The UCR006 series of ultra-compact (0.6x0.3mm) thick-film chip resistors is offered in resistances as low as 100mΩ, providing greater energy savings.
Devices feature superior dimensional accuracy for wearables
Based on innovative proprietary packaging and manufacturing technologies, ROHM have introduced a family of devices which they claim are the smallest electronic components in the industry. The RASMID (ROHM Advanced Smart Micro Device) families include ultra-compact chip resistors in 03015 (0.3 × 0.15mm) size as well as Schottky barrier diodes in 0402 (0.4 × 0.2mm) size.
Paying for the right protection
Once aware of the danger, design engineers can easily help reduce the risk of chip damage caused by user-induced overvoltage transients, such as ESD. By Phillip Havens, Principal Engineer, Littelfuse, and Chad Marak, Director of Technical Marketing and TVS Diode Array Products, Semiconductor Business, Littelfuse.
Wearable wrist device eases heart rate monitoring
Enabling users to monitor their heart rate accurately and reliably during training, CSEM has collaborated with PulseOn (a start-up spun out from Nokia in 2012) to develop a small and stylish wrist device. With wireless connectivity to iOS and Android mobile applications, the heart rate data is transformed into meaningful feedback on training: feedback that is personalised for each individual.