Search results for "miniaturisation"
Sensors will define the future of production and technology
This past year it has been difficult to open an engineering magazine and not read about the Internet of Things (IoT), Industry 4.0 or Machine-to-Machine Communications (M2MC). But all the hype and predictions will come to naught if sensor manufacturers don’t rise to the challenges before them, says Tony Ingham of Sensor Technology Ltd in Oxfordshire.
Sophisticated X-ray ensures hassle-free PCBA inspection
Subcontract manufacturers of PCBAs generally use a number of different tools for quality control, such as flying probe testers, camera-based automated optical inspection and X-ray equipment. Very few UK manufacturers can boast such sophisticated X-ray inspection capability as Newbury Electronics, following the company’s purchase of a Nikon Metrology XT V160 in January 2014.
Morgan Develops Capability For High Permittivity Substrates For High Frequency Circuits And Antenna Applications
In response to demands for miniaturisation, Morgan Advanced Materials has further developed manufacturing capabilities using temperature stabilised dielectric materials with high permittivity for advanced substrate applications.
Processor develops sophisticated ADAS applications
Designed to help car manufacturers develop sophisticated advanced driver assistance systems (ADAS) applications, the TDA3x processor family has been released by Texas Instruments. Using the automotive SoC family, manufacturers can develop ADAS applications that meet or exceed NCAP requirements, reduce collisions on the road and enable a more autonomous driving experience in entry- to mid-level automobiles.
DC-DC converter meets demand for smaller devices
MEAN WELL has produced a 5W regulated single output DC-DC converter to meet the increasing demand for system miniaturisation. The SPB05 series is in SIP (single-in-line) package form and adopts the plastic case of the 3W SPB03(0.86inx0.36inx0.44in) to 5W output.
Conference focuses on best practices for cleaning & coating
Scheduled for 18th to 20th November in Illinois, USA, SMTA and IPC have jointly announced the 'High-Reliability Cleaning and Conformal Coating Conference'. The conference will be focused on the best practices and innovative technologies required to meet manufacturing challenges and produce reliable hardware.
World’s smallest-class embedded NAND Flash memory
Toshiba Electronics Europe has launched what it claims to be the world’s smallest-class of embedded NAND flash memory products integrating NAND chips fabricated with cutting-edge 15nm process technology. The e-MMC NAND chips are designed for applications including smartphones, tablets and wearable devices.
Innovative medical solutions on show at electronica 2014
At electronica 2014, 11th to 14th November in Munich, exhibitors will present new technologies and products in the medical-electronics sector. These will focus on the ongoing miniaturisation, increased efficiency and increased networking of components that make it easier to recognise diseases early and cure them.
New packaging technologies change LED supply chain
The combination of cost reduction and advanced packaging technologies such as Flip Chip and Chip Scale Package, is changing the LED industry landscape, especially its supply chain, says Yole Developpement in an update to its technology and market analysis, LED Packaging Technology & Market Trends.
Place and route product incorporates look-ahead technology
TheIC Compiler, a place and route product, has been released bySynopsys. As part of the company'sGalaxy Design Platform, the productsupportsFinFET-based design. The tool features look-ahead technology, whichpredicts downstream processing at early stages of the design when all the information, such as detailed wiring, is not yet available.