Search results for "miniaturisation"

A range of step down DC/DC converter modules with integrated inductor, Panasonic has introduced the PSiP (Power Supply in Package) series. The devices are suitable for use as embedded power supplies (point of load) in IT and communication infrastructure equipment and industrial devices, such as small cell base stations, servers blades, surveillance cameras and measurement apparatus.

Providing reliable transmission of electrical signals, the anisotropic conductive DELOMONOPOX AC245 adhesive has been introduced by DELO Industrial Adhesives. Suitable for the reliable bonding of RFID chips and antennas, it offers high long-term die shear strength and enables efficient production as it can be jetted.

AVX has announced that it has received extensive Underwriter Laboratory (UL) certifications for9176 Series insulation displacement contacts, 9155 Series compression contacts, 9296 Series single poke home contacts and two-piece 9159 Series contacts in industrial applications.

Based on the RXv2 CPU core announced in November 2013, the RX64M microcontrollers have been announced by Renesas. The company's first product in the flagship RX 32-bit MCUs to be fabricated in a 40nm process, the MCUs offer system designers a path to quickly and efficiently develop high-performance, low-power industrial equipment that supports a wide range of communications functions.

Suitable for consumer applications such as notebooks, solid state lighting, portable gaming consoles, tablets, and mobile navigation devices, the low profile 1.2mm pitch wire-to-board connector has been introduced by FCI. With a mated height of only 2.50mm and a selection of 3 to 6 pin counts, the connector will address increasing demands for miniaturised interconnect solutions across different industries.

Enabling mobile devices that are lighter, faster and more robust, the ESD105 series of Transient Voltage Suppression (TVS) diodes have been announced by Infineon. Supplied in miniaturised integrated packages, the TVS diodes protect high speed interfaces of electronic systems from Electrostatic Discharge (ESD) strikes.

GradConn’s new fine pitch wire to board range of solutions are suitable for any application where space is at a premium such as Laptop PCs, tablets, video cameras and portable GPS systems. The new 0.8 and 1.00mm pitch wire to board range offer tiny PCB footprints and low profile mounted heights.

Expanding the company’s range of ultra low humidity drying and storage cabinets, Totech Super Dry has launched the MSD Series of desiccant storage solutions. The cabinets feature very high performance dehumidification in a modular design that costs 50% less than conventional solutions.

Responding to trends for miniaturisation and individualisation, Pentair announce the Schroff Interscale M case platform in metal. It is ideal for applications including fanless fieldbus enclosures, single-board computers, ARM modules, mobile diagnosis, therapeutic equipment for medical systems, PC-based POS systems, video monitoring for building services, and peripheral control units for industrial applications.

Demanding applications in industrial automation, point of sale (POS), point of information (POI) and digital signage can now require direct drive of up to four high resolution displays, something that advanced processors with multiple digital display interfaces are now addressing. By Konrad Löckler, Product Marketing Manager with MSC Vertriebs GmbH.