Search results for "miniaturisation"

STMicroelectronics has announced its leadership of Lab4MEMS II, an extension that builds on the continuing success of the existing Lab4MEMS project, announced in April 2013.Lab4MEMS II focuses on Micro-Opto-Electro-Mechanical Systems (MOEMS) that merge MEMS with Micro-optics to sense or manipulate optical signals using integrated mechanical, optical, and electrical systems.

TE Connectivity has officially opened its TE Wearables Lab inMenlo Park, California. Exclusively focused on wearable technologies across consumer, medical, industrial and defense businesses, the lab serves as a collaboration center for TE's team of engineers, scientists and its customers throughout the design process.

Adding to its Pyrocam family of pyroelectric laser beam profiling cameras, Ophir Photonics announced its Pyrocam IIIHR, at Photonics West. Designed for OEM applications, this camera features a sensitive 160x160 pixel image array that can profile beams up to 12.8mm without the need for reduction optics. The higher resolution, 80µm pixel pitch means it can analyse beams up to 20% smaller.

Contributing to increased miniaturisation, greater stability and longer life for EDLCs, the BD14000EFV-C cell balancing IC has been released by ROHM. The device integrates over 20 discrete components required for EDLC cell balancing on a single chip, reducing mounting area by 38%. This also eliminates component variations, making it easy to configure EDLC systems.

Murata has developed two Crystal unit products: the 2016-size (2.0x1.6mm) XRCGB-F-P series and the 1612-size (1.6x1.2mm) XRCFD-F/XRCMD-F series. A crystal unit is an electronic component oscillating at a specific frequency that utilises the piezoelectric properties of quartz crystal. It can generate high precision signals and is used as the source of clock signal for digital circuits.

According to Yole Développement, both the compute (DDR3/DDR4) and mobile varieties (LPDDR3/LPDDR4) of DDR memory will reach the end of their respective journeys soon,as the DDR interface reportedly cannot run at data rates higher than 3.2Gb/s in a traditional computermain memory environment. Several DRAM memory architectures based on 3D layer stacking and Through-Silicon-Via (TSV) have evolved to carry memory technology forward.

3D technology, which combines the versatility of the two-shot MID moulding process with the speed and precision of LDS, has been introduced by Molex. While meeting stringent medical grade guidelines, the MediSpec Moulded Interconnect Device/Laser Direct Structuring (MID/LDS) technology delivers integrated fine-pitch 3D circuitry in a single moulded package suitable for high density medical devices.

Rahman Jamal, Technology and Marketing Director for Europe at National Instruments and spokesman of the Sensors for Digital Production working group looks at the building blocks that will define the impact of Industry 4.0 on manufacturing.

Conrad Business Supplies has created an online Brand Shop for thermal management material specialist Kerafol to provide customers with a single point where they can gather detailed technical information and product data to help solve thermal management design challenges. .

Designed to improve the performance of high-voltage IGBTs in voltage classes from 1200V up to 6.5kV, two power module platforms have been released by Infineon Technologies. Currently, the power module platforms are suitable for 3.3, 4.5, and 6.5kV IGBTs measuring 100x140x40mm.