Search results for "miniaturisation"

At Embedded World 2015, HEITEC presented its latest packaging and system solutions as well as design services for embedded solutions themedFit for Embedded 4.0. The company has expanded its comprehensive housing portfolio with CompactPCI Serial platforms that provide answers to many design requirements.

ROHM will present its latest power product designs at PCIM,Nuremberg, from 19thto 21stMay (Hall 9, Booth 316).Demand for high performance, power, reliability, cost and energy efficiency, as well as miniaturisation, puts stress on power device design. ROHM’s novelties offer beneficial characteristics and compact packaging solutions, based on the company’s R&D activities and micro fabrication technologies.

High service distribution is changing. The age of the simple component distributor is dead. Customers and suppliers are demanding a manufacturing partner who can offer both a full design solution and the high level of service they have come to expect. By Phil Gee, Director, Corporate OEM/CEM, Farnell element14.

ams has introduced an integrated power management unit with an especially small footprint for use in wearables and other space-constrained devices. The AS3701 micro-PMIC with low quiescent current implements multiple power-regulation, power-saving, battery-charging, protection and start-up functions in a WL-CSP measuring just 2x2x0.4mm.

Exhibiting at the annual Applied Power Electronics Conference and Exhibition (APEC), eight of AVX’s top engineers and technical product managers will be at booth #321. They will provide attendees with extensive information about the new products and series extension that AVX will debut at the show: a contact for harsh environment applications, an MLCC series for UHF band applications, a tantalum capacitor series for industrial, telecomms an...

Adding a sidewall patterning capability to its custom thin film substrate offering, Vishay Intertechnology can now provide conductive patterning on up to four surfaces with compact line width and gap dimensions, increasing design flexibility and density for miniaturisation in military, aerospace, medical and telecomms equipment.

IRT Nanoelec and CMP are jointly launching a platform for Multi-Project-Wafer, post-process 3D integration (3D-MPW).The disruptive 3D configurations and assemblies created by this IRT Nanoelec/CMP initiative are designed to promote 3D integration.This service, the first of its kind, extends CMP’s regular MPW offer by using 3D post-process technologies at wafer level from IRT Nanoelec.

Infineon Technologies has announced that more than 1bn ultra-small TVS diodes in the company’s bare silicon WLL package were delivered to customers in 2014.TVS diodes in WLL packages are used in applications where miniaturisation is a priority, including touch screen and keypad interfaces and the increasingly popular high-speed data ports used in mobile electronics.

Biophotonics and medical engineering will again be centre stage at the LASER World of PHOTONICS, which takes place from 22nd to 25th June at the Messe München site.

There can be little debate about the benefits of the miniaturisation of electronics devices and their ever-increasing functions, but they can give designers headaches; when marketing departments freeze the form factor and specifications of the end-device, designers and PCB layout experts must deal with it, making their jobs a balancing act. Once the core ICs have been selected and placed on the board, they must design basic, but essential, circui...