Search results for "miniaturisation"
Chipset reduces passive component count by 40%
Designed to drive market availability of normally-on (JFET, MESFET) as well as normally-off (MOSFET) transistors, the XTR26020 chipset has been introduced by X-REL Semiconductor. This 2nd gen driver is 25% smaller than the XTR260010 chipset and reduces the quantity of required passive components by 40%. The device has led to a first-ever compact half bridge solution by X-REL.
Mixed signal methodology offers high automation
The Intelligent IP Mixed Signal Design Flow methodology developed by the Design Automation group at the Fraunhofer Institute for ICs IIS offers an unparalleled degree of automation, especially for the otherwise time-consuming, error-prone analogue portion of the design.Mixed-signal ICs are found in many of today's microelectronics, from safety-critical automotive applications to medical and aerospace systems.
Copper alloy database is free-of-charge
A database for designers specifying copper alloys for demanding applications has been introduced by the Copper Development Association. The Copper Alloys Knowledge Base, which is free to use, is a joint project from the European Copper Institute and AGH University of Science and Technology in Krakow.
Building blocks for smart lighting designs
Lighting system design based on LED and OLED technologies is challenging. Successful LED lighting solutions require a holistic design and engineering approach. Hence, it is necessary to incorporate latest technologies, smart systems, new standards, advanced functionalities and user behaviours.
ROHM develops IC for Freescale i.MX 6SoloLite processors
ROHM has announced the development of a high efficiency power management IC optimised for Freescale Semiconductor’s i.MX 6SoloLite applications processor.
Synchronous buck DC/DC IC design
Besides the power efficiency, a key performance requirement for point of load power supply ICs is the transient performance. Sudden changes in the current drawn by the load (for example, an FPGA) require a fast response from the power supply. Such fast variations of the output current, however, cause transient spikes on the output voltage, whose amplitude and duration depend on the transfer function of the regulation loop.
SiC MOSFET enables miniaturisation in pulse generators
Fukushima SiC Applied Engineering has selected ROHM’s SCT2080KE SiC MOSFET for use in its SiC-Pulser series of high voltage pulse generators.Pulse generators are used in a variety of applications, including high voltage accelerators, plasma generators and laser processing machines. Conventional systems utilise silicon devices or vacuum tubes as switching elements. However, this often entails a large number of system components which results...
SKEDD direct plug-in technology
Phoenix Contact has opted for the latest SKEDD direct plug-in technology from Würth Elektronik ICS. The SKEDD technology provides a new way of contacting using connection technology on the PCB.
Hybrid vehicle range extenders: goodbye pistons
Dr Peter Harrop, Chairman, IDTechEx Hybrid vehicles are already big business from hybrid cars, buses and trucks to outdoor forklifts, even hybrid tugboats. Indeed, many hybrid aircraft will soon appear. An increasing majority of hybrid powertrains are series hybrids where the engine only charges the battery: it never drives the wheels. As explained in the IDTechEx report, Range Extenders for Electric Vehicles Land, Water & Air 2015-2025, th...
TO suits thermoelectrically cooled 10Gb/s laser diodes
SCHOTT has expanded its design portfolio of TO packages for the 10Gb/s range to suit high-frequency, actively cooled applications. SCHOTT's latestTEC TO package enables the development of high-speed data transfer in the telecomms and datacomms markets and suits 10Gb/s laser diodes that require a ThermoElectric Cooler (TEC), enabling its application in middle to long distances.