Search results for "miniaturisation"

ROHM has recently announced the development of an AC/DC converter control IC designed specifically for SiC MOSFET drive in industrial equipment such as servers and other large power applications.

Molex's Multi-Port RF (MPRF) coaxial cable-to-board solutions ensure a secure I/O connection for PCB designers and test and measurement engineers in high vibration conditions. Featuring a rugged single housing design with dual latches to support the weight of the coaxial cables, the connectors meet the shrinking space demands for electronic devices in telecomms and networking; data comms and computing; aerospace and defence; and medical industrie...

FCI is proud to announce the latest Minitek MicroSpace 1.27/1.5mm crimp-to-wire connector. The unique design of the connector enables contact pitch compatibility with the LV214 Severity-2 standard.The connectoris suitable when high vibration endurance is required. The design features primary and secondary contact retention, poka-yoke polarisation and a visual mismatch prevention system that eliminates application errors. A terminal positioning as...

Maxtena’s SATFleet Iridium/GPS fleet solution consists of two separate high performance antennas in one compact and secure housing: one helix Iridium enabling Voice and Data and one high gain active GPS antenna. By leveraging techniques in antenna miniaturisation showcased in its other products, Maxtena's SATFleet provides maximum performance in a compact, easy to install form factor.

According to Yole Développement (Yole), by 2024 the IoT device market will represent a $45bn business contributing to a total IoT market of $400bn. At this year’s Sensors Expo & Conference the company will review its latest IoT results and the related MEMS and sensor sectors at Pre-Conference Symposium 3, titled IoT, the final frontier for embedded, which takes place on 9th June from 9:30am to 5:30pm. In his presentation, Sensors...

ROHM has announced the development and mass production of a SiC MOSFET that adopts the world's first trench structure. Compared to existing planar-type SiC MOSFETs, RDS(ON) is reduced by 50% in the same chip size, making it possible to significantly decrease power loss in a variety of equipment, from industrial inverters and power supplies to power conditioners for solar power systems.

TDK Corporation has expanded its lineup of common-mode filters with the thin-film TCM0403R, offering a common-mode attenuation of 27.5dB at 850MHz in a 0.45x0.30mm 0403 package, the world’s highest value for this case size. The footprint of the TCM0403R is nearly 60% smaller than the existing TCM0605R with same common-mode attenuation.

Advanced Semiconductor Engineering (ASE) and TDK have announced that they will enter into an agreement to establish a joint venture company to manufacture IC embedded substrates using TDK's Semiconductor Embedded SUBstrate (SESUB) technology. ASE and TDK plan to own 51% and 49%, respectively, of the newly created entity. The indicative name of the joint venture company will be ASE Embedded Electronics, and its manufacturing facility is planned to...

Claimed to be the world’s first trench-type SiC MOSFET, Rohm has announced mass production of an SiC MOSFET that reduces on resistance by 50%, compared to planar SiC MOSFETs, says the company.

First introduced in its Han-Yellock connector family, HARTING's innovative bridge block multiplier technique has been extended to many other Han connectors. By incorporating the additional contacts within the connector housing, the bridge block enables simplified wiring and reduced space requirements.