Search results for "miniaturisation"
EM Microelectronic's em|bleu: new Bluetooth 5.4 benchmark
In an era where technology races towards miniaturisation with increased integration and minimum power consumption, the demand for more compact, energy-efficient devices with no compromise on performance has never been higher.
Non-metallic materials to shape emerging connector manufacturing processes
Advances in non-metallic (organic) materials science will undoubtedly drive the future of commercial, military, and aeronautic electronic interconnect materials and plating.
SEMICON Japan 2023 showcasing emerging technologies
SEMICON Japan opens 13th Dec. at Tokyo Big Sight with more than 900 exhibitors from 19 regions showcasing their latest products and technologies.
Who is Morris Chang? The TSMC visionary
Morris Chang, a luminary in the semiconductor industry, has played a monumental role in shaping today's technology landscape. His journey from an ambitious student to the founder of Taiwan Semiconductor Manufacturing Company (TSMC) and his ongoing influence in the industry presents a story of remarkable achievement and visionary leadership.
ROHM and Toshiba agree to collaborate in manufacturing power devices
A plan by ROHM and Toshiba Electronic Devices and Storage to collaborate in the manufacture and increased volume production of power devices has been recognised and will be supported by the Ministry of Economy, Trade and Industry as a measure supporting the Japanese Government’s target of secure and stable semiconductor supply.
An artificial helping hand
Upper limb prosthetics are abandoned by some18%of patients, though some studies cite this figure as high asalmost one in two.
PCIM Europe 2024 on a new record course
The PCIM Europe 2024 promises even more highlights for experts in the power electronics industry from 11 - 13 June 2024 in Nuremberg.
What’s down the line for EV charging stations?
Speeding up charging time has implications for the power semiconductor industry (IGBTs, MOSFETs) as well as power management ICs and microcontrollers.
Hybrid bonding for data highways
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.
Provertha expands range of circular connectors
Provertha is expanding its range of circular connectors with the introduction of the new M12 Ruggedised connector series, available in both straight and angled versions for PCB mounting via Surface Mount Technology (SMT).