Search results for "miniaturisation"

Dacom West GmbH announces it is a new member of the Single Pair Ethernet (SPE) System Alliance. This conscious decision was made to strengthen the company’s position in the field of industrial network technologies and at the same time to actively participate in the further development of future-oriented communication solutions.

Themed‘Innovation and Collaboration: Powering Sustainable Exponential Growth’,SEMICON Europa2024will gather industry experts 12–15 November 2024 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management, and workforce.

Electronic Specifier recalls the recent Engineering Design Show 2024 (EDS 2024), noting the key highlights from the event.

SEMICON Europa 2024 will gather industry experts November 12-15 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management and workforce.

As electronic devices continue to shrink, the limitations of physical size are increasingly hindering the ability to double transistor density on silicon microchips every two years, a trend known asMoore’s law.

The German DIE Bonder specialist Treskyhas introduced a highly precise photonics bonder.

An international team of researchers has made advancements in the detection of neurodegenerative diseases such as Alzheimer’s and Parkinson’s.

In many miniaturised electronics applications, conventional cable wiring is both costly and material-intensive, limiting the potential for innovation and product performance.

Researchers atChalmers Universityof Technology, in Sweden, have for the first time succeeded in combining two major research fields in photonics by creating a nanoobject with unique optical qualities.

Semiconductor manufacturing processes require many chemicals and specialty gases.