Search results for "miniaturisation"

The countdown is on for SMTconnect, which will commence in three months in the exhibition halls of Nuremberg, Germany. From 11 – 13 June 2024.

ROHM recently disclosed that its 650V GaN device, branded as EcoGaN, has been integrated into the C4 Duo, a 45W USB-C charger by Innergie, a subsidiary of Delta.

Nanotechnology firm Chiral announced it has secured $3.8 million in funding, pioneering the integration of nanomaterials into electronic devices.

Electromagnetic interference (EMI) shielding is adapting to meet the demands of evolving communications technology.

StenTech has announced the launch of its groundbreaking stencil coating technology, the StenTech BluPrint CVD (Chemical Vapor Deposition) Surface Treatment, aimed at advancing the Surface Mount Technology (SMT) processes.

Hirose has expanded its back flip FPC/FFC connector offering to include a 0.5 mm pitch version that offers dual contact functionality to simplify flex routing.

Siemens Digital Industries Software has recently announced its introduction of a novel method for distributing precise thermal models of integrated circuit (IC) packages throughout the electronics supply chain.

Infineon Technologies combines its expertise in magnetic position sensors with its linearised tunnel magnetoresistance (TMR) technology to launch the XENSIV TLI5590-A6W magnetic position sensor.

ABLIC has launched the S-19954/5 Series, a new line of automotive step-down switching regulators.These regulators operate at 5.5V with a 1A output and are noted for being housed in the smallest package in the industry, measuring just 1.6 x 1.6 x t0.41mm (HSNT-8(1616)B package).

Infineon has announced the launch of its new magnetic position sensor, the XENSIV TLI5590-A6W. This sensor, featuring a wafer-level package, is designed for both linear and angular incremental position detection.