Search results for "chips"

XMOS Semiconductor has introduced a development kit providing everything needed to develop a wide range of applications using its XS1-G4 programmable device. Designs are created using a C-based software development flow that dramatically shortens the time required to build electronic products and systems.

CETECOM has selected Spirent’s 8100 Location Technology Solution to provide the industry’s first and only SUPL 2.0 conformance test capability for GSM and WCDMA devices, based on standards from the Open Mobile Alliance (OMA).

Advanced Thermal Solutions, Inc. (ATS) has partnered with Digi-Key, the global electronic components distributor, to offer over 380 heat sinks for cooling BGAs and other hot-running semiconductor devices. The heat sinks are available for immediate delivery when purchased through Digi-Key’s Web site and printed catalogs. Design engineers can obtain individual ATS sinks for prototypes and testing, or larger volumes for production requirements. D...

NEC Electronics has announced an integrated USB2.0 host and peripheral controller designed to enable high-speed digital data sharing among electronic equipment such as digital camera and printer. On a single chip, the PD720150 integrates communications functions that formerly required separate USB host and controller chips. In addition to reducing the device count and saving board space, it facilitates software development by implementing numer...

NEC Electronics and ELMOS Semiconductor AG are going to join forces demonstrated by entering into a worldwide long-term partnership. The agreement will encompass the joint development, cross-use of engineering and manufacturing services as well as common marketing of products for the automotive and industrial markets.

Viaccess, a France Telecom company and leader in conditional access and NEC Electronics (Europe) GmbH, a leading semiconductor manufacturer, today announced their collaboration to offer Viaccess’ conditional access incorporated in NEC Electronics’ new EMMA™3SL/P system-on-chip (SoC), targeted at MPEG-4 HD hybrid set-top boxes (STBs).

NEC Electronics announced the completion of the semiconductor platform solution Medity 2. Medity eases the development of mobile phones corresponding to the third and second generation communication standards HSDPA/W-CDMA and GSM/GPRS. Medity 2 consists of 5 components: (1) M2 which is an integrated chip with baseband processing functions and application processor, a semiconductor chipset that includes wireless frequency processing (RF) ICs and p...

NEC Electronics has announced that it has commercialized EMMA Mobile 1, an optimal system LSI chip for the market of portable devices to process audio and visual data, such as portable multi-media players and mobile TVs. Samples of the new EMMA Mobile 1 are available now.

International Rectifier has introduced the IR3521 and IR3529 XPhase® chipset solution offering best-in-class efficiency over the entire load range for next-generation high performance AMD processors. The IR3521 XPhase control IC supports high speed (HS) I2C serial communications to provide overall system control, interfacing with any number of phase ICs, each driving and monitoring a single phase. When used with the IR3529 XPhase phase IC, the ...

PMC-Sierra has announced that ECI Telecom, a global provider of networking infrastructure solutions, has selected PMC-Sierra’s ADM 622, ARROW 2488, TEMAP 84FDL and HDLIU 32 devices for its BroadGate (BG) Multi-Service Provisioning Platform (MSPP) family, including the BG-20 and BG-30. ECI’s BG family has helped position the company as the number-one ranked transmission equipment vendor in India for the past three consecutive years according ...