Search results for "chips"

BVM introduced the EBC-965, a fanless Socket P Core 2 Duo embedded computer module housed in an open frame chassis with an integral heat sink, which also enables simple mounting within a larger assembly. Ideal for use as the engine in media-rich applications such as public information points, kiosks, multi-media displays with audio for retail stores or exhibitions and similar applications, the EBC-965 supports dual VGA and TV out, driven by an in...

The P4ELA from BVM is an SBC conforming to the Micro ATX 244 x 244mm form factor. It is ideally suited as the platform for high-performance systems in industrial workstation, industrial control and automation, pos, gaming, print imaging, digital signage, digital surveillance, network security and similar applications that require processing horsepower and fast graphics capability.

The new HS-771 SBC from BVM is a half size (185 x 122mm) PCI card form factor unit that is ideal for embedded applications where physical space is at a premium. Despite its compact size, the SBC supports Socket P pin-out processors such as the Intel Core 2 Duo Mobile Penryn or Core 2 Extreme with a FSB up to 1066 MHz addressing up to 4GB of RAM.

The BVM Group has launched the LV-67G, a high performance Mini-ITX motherboard, ideal for demanding heavy processing tasks such as industrial control and automation, retail POS and ticketing, gaming, print imaging and digital signage. Based on the Q67 Express Chipset, it supports the second-generation Sandy Bridge Intel Core i7/i5/i3 processors in the LGA1155 socket with up to 16GB of 1333 MHz DIMM. Intel Pentium and Xeon processors are also supp...

The BVM Group has introduced the LS-574, a 5.25 inch SBC that offers low power consumption without compromising on performance. Based on the QM67 chipset, the LS-574 features a second-generation Sandy Bridge Intel Core i7/i5/i3 mobile processor in the rPGA988B socket. Typical applications are in industrial control and automation, gaming machines, kiosks, medical instruments, video servers, print imaging, digital signage and many other areas where...

Vishay today announced that its Vishay Foil Resistors division has released a new family of ultra-high-precision Bulk Metal Z-Foil hybrid chip resistors. Offering an order of magnitude improvement over other chip resistors for hybrid applications, the new V5X5Z, V15X5Z, and V15X10Z are the industry's first to offer low typical TCR of 0.05ppm/°C from 0°C to +60°C and 0.2ppm/°C from -55°C to +125°C, +25°C ref., TCR tracking to 0.5ppm/°C, f...

Vishay has introduced the improved VSMP0603 ultra-high-precision Bulk Metal® Z-Foil (BMZF) wraparound surface-mount resistor with an extended power rating to 0.1 W and higher resistance values to 5 kΩ. The device is the industry's first in the 0603 chips size to offer a military-grade absolute TCR of ±0.2 ppm/°C from −55°C to +125°C, +25°C ref., a tolerance of ±0.01%, and an almost immeasurable 1-ns rise time, effectively withou...

Ikanos Communications today introduced NodeScale Vectoring. This breakthrough DSL access technology enables 100 megabit per second (Mbps) performance and beyond, speeds that were previously unattainable in the vast majority of the world's service provider networks. By deploying Ikanos' state-of the-art NodeScale Vectoring technology, service providers will be able to extend very high-speed Internet access and new critical services - including mul...

Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today's electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices. Master Bond's white paper examines the challenges design engineers face...

XMOS has released a new package option for the G4 programmable device, the first member of the XS1-G4 family. The new 144-pin BGA package option is designed for systems that require the smaller form factor (11mm square). With a .8mm ball pitch it is ideal for compact designs and simple PCB layout. For designs that require a full complement of 256 I/O pins a 512-pin BGA package is available.