Search results for "chips"
Pragmatic Semiconductor to revolutionise NFC connectivity with sustainable flexible chips
Pragmatic Semiconductor has announced the launch of its latestradio frequency identification(RFID) near-field communication (NFC) product line, Pragmatic NFC Connect.
TI unveils chips boosting protection, density and efficiency for data centres
Texas Instruments (TI) has debuted new power-management chips to support the rapidly growing power needs of modern data centres.
YINCAE: UF 158UL redefines underfill for large chips
YINCAE has unveiled its latest innovation in underfill materials with the introduction of UF 158UL. This advanced underfill solution is engineered to address the increasing challenges associated with large format chips, offering superior performance in flowability, rapid curing, and long-term reliability. As semiconductor technology continues to evolve, the need for highly efficient and dependable underfill materials becomes more critical, partic...
DeepSeek will mean more demand for NVIDIA chips
GraniteShares, a provider of exchange-traded products, offers commentary on the recent significant movement in NVIDIA’s stock price.
TI introduces new integrated automotive chips
Texas Instruments (TI) recently introduced new integrated automotive chips to enable safer, more immersive driving experiences at any vehicle price point.
Deep-UV microLED display chips for maskless photolithography
In a breakthrough set to revolutionisethe semiconductor industry, the School of Engineering of the Hong Kong University of Science and Technology (HKUST) has developed the world’s first-of-its-kind deep-ultraviolet (UVC) microLED display array for lithography machines.
MIT engineers grow ‘high-rise’ 3D chips
An electronic stacking technique could exponentially increase the number of transistors on chips, enablingmore efficient AI hardware.
A leap toward more powerful and efficient computer chips
In a significantadvance for semiconductor technology, researchers at the University of Virginia (UVA) have confirmed a fundamental principle governing heat flow in ultra-thin metal films.
sureCore teams with Sarcina to package cryo chips
Further to sureCore’s recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180nm and 22nm process nodes, the company has revealed that it has teamed with packaging experts, Sarcina, who designed a custom package specifically for use at cryogenic temperatures.
Microchip releases system basis chips
Microchip has announfced the new family of ATA650x CAN FD System Basis Chips (SBCs) with a fully integrated high-speed CAN FD transceiver and a 5V Low-Drop Voltage Regulator (LDO) available in compact 8-, 10- and 14-pin space-saving packages.