Search results for "chips"

Omnitrol Networks and Texas Instruments announced today an alliance to deliver a radio frequency identification (RFID) real-time traceability solution for printed circuit board (PCB) manufacturing applications. The new offering, which integrates Omnitrol Networks’ Work-in-Process visibility software and TI’s Gen 2 chip technology, provides electronic and contract manufacturers a highly automated method of simultaneously identifying and track...

Texas Instruments (TI) has announced a new DOCSIS 3.0 (Data Over Cable Service Interface Specification) product that supports cable set-top-boxes (STB) with both MPEG-TS (transport stream) and Internet Protocol (IP) capabilities. This latest addition to the Puma 5 family provides equipment manufacturers with the ability to create a new breed of hybrid STB products. STBs with TI’s Puma 5 solution enable cable operators to extend their curren...

Nexcom’s NISE 3140M series is a rugged range of Fanless PC which is targeted at medical computing applications. Utilising the Intel® GM45 chipset all products in the NISE 3140M range are highly scalable and can support a wide variety of Intel Core 2 Duo and Celeron CPUs.

Arteris and CoWare Inc, has announced a comprehensive agreement under which Arteris will output SystemC transaction level models (TLM) from its NoC tool suite for incorporation into TLM platforms developed in CoWare Platform Architect.

Jennic Ltd. has introduced JenNet, a new free proprietary wireless networking stack for its powerful range of 32 bit single chip wireless microcontrollers. Based on the IEEE802.15.4 standard, it is specially designed to be easy to use and is fully scalable from just a few nodes to large networks of up to 1,000 nodes.

Dataman has recently released a new 48-pin universal programmer which currently supports more than 52,000 devices. Since programming times are faster than ever before, this new product will appeal not only to the community of hardware developers, but also to small and medium sized manufacturers.

Renesas Electronics today announced the availability of its new system-on-chip (SoC) for high-end set-top boxes (STBs) the R-Home S1, supporting both worldwide digital TV broadcast reception and Internet content distribution.

Renesas Technology Corp. and ZMD AG have announced a joint development agreement enabling Renesas to incorporate ZMD’s RF technology into Renesas microcontrollers (MCU) to develop a 900MHz band ZigBee chipset. Based on this agreement, the two companies will set up a collaborative development team with the aim of bringing a ZigBee chipset to market. The resulting advanced chipset is expected to accelerate the development of various types of IEEE...

Renesas Technology Corp., Fujitsu Limited, and Sharp Corporation today announced that they plan to jointly develop the SH-Mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA1/HSDPA2/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards. Development of the platform is targeted for completion by the forth quarter of fiscal 2009 (January–March 2010).

Renesas Technology Europe today announced the release of the R8C/Mx Series of low-pin-count MCUs with on-chip flash memory (flash MCUs) offering power consumption among the lowest in the industry and improved functions including timers for applications requiring low power consumption, such as electric shavers, electric toothbrushes, and other compact electrical household appliances.